China Wholesale Micro Snap Switch Quotes - DK4-BD-005 – Tongda
China Wholesale Micro Snap Switch Quotes - DK4-BD-005 – Tongda Detail:
(The defining characteristics of operation) |
(Operating Parameter) |
(Abbreviation) |
(Units) |
|
(Free Position) |
FP |
mm |
(Operating Position) |
OP |
mm |
|
(Releasing Position) |
RP |
mm |
|
(Total travel Position) |
TTP |
mm |
|
(Operating Force) |
OF |
N |
|
(Releasing Force) |
RF |
N |
|
(Total travel Force) |
TTF |
N |
|
(Pre Travel) |
PT |
mm |
|
(Over Travel) |
OT |
mm |
|
(Movement Differential) |
MD |
mm |
Switch technical Characteristics
(ITEM) |
(technical parameter) |
(Value) |
|
1 |
(Electrical Rating) | 10(1.5)A 250VAC | |
2 |
(Contact Resistance) | ≤50mΩ( Initial value) | |
3 |
(Insulation Resistance) | ≥100MΩ(500VDC) | |
4 |
(Dielectric Voltage) | (between non-connected terminals) | 500V/0.5mA/60S |
(between terminals and the metal frame) | 1500V/0.5mA/60S | ||
5 |
(Electrical Life) | ≥10000 cycles | |
6 |
(Mechanical Life) | ≥3000000 cycles | |
7 |
(Operating Temperature) | -25~105℃ | |
8 |
(Operating Frequency) | (electrical):15 cycles(Mechanical):60 cycles | |
9 |
(Vibration Proof) |
(Vibration Frequency):10~55HZ; (Amplitude):1.5mm; (Three directions):1H |
|
10 |
(Solder Ability): (More than 80% of immersed part shall be covered with solder) | (Soldering Temperature):235±5℃(Immersing Time):2~3S | |
11 |
(Solder Heat Resistance) | (Dip Soldering):260±5℃ 5±1S(Manual Soldering):300±5℃ 2~3S | |
12 |
(Safety Approvals) |
UL、CSA、TUV、ENEC |
|
13 |
(Test Conditions) | (Ambient Temperature):20±5℃(Relative Humidity):65±5%RH
(Air Pressure):86~106KPa |
Product detail pictures:

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