DK4-BZ-007
|
(The defining characteristics of operation) |
(Operating Parameter) |
(Abbreviation) |
(Units) |
|
|
(Free Position) |
FP |
mm |
| (Operating Position) |
OP |
mm |
|
| (Releasing Position) |
RP |
mm |
|
| (Total travel Position) |
TTP |
mm |
|
| (Operating Force) |
OF |
N |
|
| (Releasing Force) |
RF |
N |
|
| (Total travel Force) |
TTF |
N |
|
| (Pre Travel) |
PT |
mm |
|
| (Over Travel) |
OT |
mm |
|
| (Movement Differential) |
MD |
mm |
Switch technical Characteristics
|
（ITEM） |
（technical parameter） |
（Value） |
|
|
1 |
（Electrical Rating） | 10(1.5)A 250VAC | |
|
2 |
（Contact Resistance） | ≤50mΩ( Initial value) | |
|
3 |
(Insulation Resistance) | ≥100MΩ(500VDC) | |
|
4 |
（Dielectric Voltage） | （between non-connected terminals） | 500V/0.5mA/60S |
| (between terminals and the metal frame) | 1500V/0.5mA/60S | ||
|
5 |
(Electrical Life) | ≥10000 cycles | |
|
6 |
(Mechanical Life) | ≥3000000 cycles | |
|
7 |
（Operating Temperature） | -25～105℃ | |
|
8 |
（Operating Frequency） | （electrical）:15 cycles（Mechanical）:60 cycles | |
|
9 |
（Vibration Proof） |
（Vibration Frequency）：10～55HZ； （Amplitude）：1.5mm; （Three directions）:1H |
|
|
10 |
(Solder Ability): (More than 80% of immersed part shall be covered with solder) | (Soldering Temperature)：235±5℃(Immersing Time)：2～3S | |
|
11 |
（Solder Heat Resistance） | （Dip Soldering）：260±5℃ 5±1S（Manual Soldering）：300±5℃ 2～3S | |
|
12 |
（Safety Approvals） |
UL、CSA、TUV、ENEC |
|
|
13 |
（Test Conditions） | （Ambient Temperature）：20±5℃（Relative Humidity）：65±5%RH
（Air Pressure）：86～106KPa |
|
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