HK-04G-1AZ-029
| (Halayen ma'anar aiki) | (Operating Parameter) | (Taƙaice) | (Raka'a) | (darajar) |
|
| (Mataki Kyauta) | FP | mm | 12.1 ± 0.2 |
| (Matsayin Aiki) | OP | mm | 11.5 ± 0.5 | |
| (Matsayin Saki) | RP | mm | 11.7± 0.5 | |
| (Jimlar Matsayin tafiya) | TTP | mm | 10.5± 0.3 | |
| (Rundunar Ayyuka) | OF | N | 1.0 zuwa 3.5 | |
| (Karfin Saki) | RF | N | - | |
| (Jimlar tafiye-tafiye Force) | TTF | N | - | |
| (Kafin Tafiya) | PT | mm | 0.3 zuwa 1.0 | |
| (A kan Tafiya) | OT | mm | 0.2 (min) | |
| (Bambancin Motsi) | MD | mm | 0.4 (Max) |
Canja Halayen fasaha
| (ITEM) | (ma'auni na fasaha) | (Daraja) | |
| 1 | (Kimanin Lantarki) | 5 (2) A 250VAC | |
| 2 | (Contact Resistance) | ≤50mΩ(ƙimar farko) | |
| 3 | (Juriya na Insulation) | ≥100MΩ(500VDC) | |
| 4 | (Dielectric Voltage) | (tsakanin tashoshin da ba a haɗa su ba) | 500V/0.5mA/60S |
|
|
| (tsakanin tashoshi da karfen karfe) | 1500V/0.5mA/60S |
| 5 | (Rayuwar Wutar Lantarki) | ≥10000 hawan keke | |
| 6 | (Rayuwar Makanikai) | ≥100000 hawan keke | |
| 7 | (Aikin Zazzabi) | -25 ~ 125 ℃ | |
| 8 | (Yawan Aiki) | (lantarki): 15hawan keke (Makanikanci): 60hawan keke | |
| 9 | (Hujja ta Jijjiga) | (Yawan Vibration): 10 ~ 55HZ; Girman girma: 1.5mm; (Hanyoyi uku): 1H | |
| 10 | (Irin Solder): (Fiye da kashi 80% na ɓangaren da aka nutsar za a rufe shi da mai siyarwa) | (Siyarwa Zazzabi): 235 ± 5 ℃ (Lokacin Ciki): 2～3S | |
| 11 | (Solder Heat Resistance) | (Dip Soldering): 260 ± 5 ℃ 5 ± 1S (Sayar da Manual): 300± 5℃ 2～3S | |
| 12 | ( Amincewa da Tsaro ) | UL, CSA, VDE, ENEC, CE | |
| 13 | (Sharuɗɗan gwaji) | (Zazzabi na yanayi) ：20± 5℃ (Yancin Dangi): 65± 5% RH (Matsin Iska): 86 ~ 106KPa | |
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