HK-04G
Canja aikin Halaye
Halayen ma'anar aiki | Sigar Aiki | Gajarta | Raka'a | Daraja |
Matsayin Kyauta | FP | mm | 12.1 ± 0.2 | |
Matsayin Aiki | OP | mm | 11.5 ± 0.5 | |
Matsayin Saki | RP | mm | 11.7± 0.5 | |
Jimlar Matsayin tafiya | TTP | mm | 10.7 | |
Karfin Aiki | OF | N | 1.0-3.5 | |
Ƙarfin Sakin | RF | N | - | |
Jimlar Ƙarfin balaguro | TTF | N | - | |
Kafin Tafiya | PT | mm | 0.3 ~ 1.0 | |
Over Travel | OT | mm | 0.2 Min | |
Banbancin Motsi | MD | mm | 0.4 max |
Canja Halayen fasaha
ITEM | ma'aunin fasaha | Daraja | |
1 | Ƙimar Lantarki | 5A/10A 250VAC | |
2 | Tuntuɓi Resistance | ≤50mΩ Ƙimar farko | |
3 | Juriya na Insulation | ≥100MΩ500VDC | |
4 | Dielectric Voltage | tsakanin tashoshin da ba a haɗa su ba | 500V/0.5mA/60S |
tsakanin tashoshi da karfe frame | 1500V/0.5mA/60S | ||
5 | Rayuwar Lantarki | ≥10000 hawan keke | |
6 | Rayuwar Injiniya | ≥100000 hawan keke | |
7 | Yanayin Aiki | 0 ~ 125 ℃ | |
8 | Mitar Aiki | lantarki:15hawan kekeMakanikai:60hawan keke | |
9 | Tabbacin Jijjiga | Mitar Jijjiga: 10 ~ 55HZ; Girma: 1.5mm; Hanyoyi uku: 1H | |
10 | Ikon Solder: Fiye da 80% na ɓangaren da aka nutsar da shi za a rufe shi da mai siyarwa | Zazzabi mai siyarwa: 235 ± 5 ℃ Lokacin Immersing: 2 ~ 3S | |
11 | Solder Heat Resistance | Dip Soldering: 260 ± 5 ℃ 5 ± 1Smanual Soldering: 300 ± 5 ℃ 2 ~ 3S | |
12 | Amincewa da Aminci | UL, CSA, VDE, ENEC, CE | |
13 | Yanayin Gwaji | Yanayin yanayi:20±5℃ Dangi Humidity: 65± 5% RH Hawan iska: 86 ~ 106KPa |
Canja aikace-aikacen: ana amfani da shi sosai a cikin kayan aikin gida daban-daban, kayan lantarki, kayan aikin sarrafa kansa, kayan sadarwa, na'urorin lantarki, kayan aikin wuta da sauran fannoni.
11
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