HK-14-16AP-613
| Halayen ma'anar aiki | Sigar Aiki | Daraja | Raka'a |
 | Matsayin Kyauta FP | 15.9± 0.2 | mm |
| Matsayin Aiki OP | 14.9± 0.5 | mm | |
| Matsayin Sakin RP | 15.2 ± 0.5 | mm | |
| Jimlar Matsayin tafiya | 13.1 | mm | |
| Aiki Force OF | 0.25 ~ 4 | N | |
| Sakin Ƙarfin RF | - | N | |
| Jimlar tafiye-tafiye Force TTF | - | N | |
| Pre Travel PT | 0.5 ~ 1.6 | mm | |
| Over Travel OT | 1.0 Minti | mm | |
| Banbancin Motsi MD | 0.4 max | mm |
Canja Halayen fasaha
| ITEM | ma'aunin fasaha | Daraja | |
| 1 | Tuntuɓi Resistance | ≤30mΩ Ƙimar farko | |
| 2 | Juriya na Insulation | ≥100MΩ500VDC | |
| 3 | Dielectric Voltage | tsakanin tashoshin da ba a haɗa su ba | 1000V/0.5mA/60S |
| tsakanin tashoshi da karfe frame | 3000V/0.5mA/60S | ||
| 4 | Rayuwar Lantarki | ≥50000 hawan keke | |
| 5 | Rayuwar Injiniya | ≥1000000 hawan keke | |
| 6 | Yanayin Aiki | -25 ~ 125 ℃ | |
| 7 | Mitar Aiki | lantarki: 15 hawan keke Makanikai: hawan keke 60 | |
| 8 | Tabbacin Jijjiga | Mitar girgiza: 10 ~ 55HZ; Girma: 1.5mm; Hanyoyi uku: 1H | |
| 9 | Ikon Solder: Fiye da 80% na ɓangaren da aka nutsar da shi za a rufe shi da mai siyarwa | Zazzabi mai siyarwa: 235 ± 5 ℃ Lokacin Nitsewa: 2 ~ 3S | |
| 10 | Solder Heat Resistance | Dip Soldering: 260± 5℃ 5± 1S Siyar da Manual: 300± 5℃ 2 ~ 3S | |
| 11 | Amincewa da Aminci | UL, CSA, VDE, ENEC, TUV, CE, KC, CQC | |
| 12 | Yanayin Gwaji | Yanayin yanayi: 20± 5 ℃ Danshi mai Dangi: 65± 5% RH Hawan iska: 86 ~ 106KPa | |
Canja aikace-aikacen: ana amfani da shi sosai a cikin kayan aikin gida daban-daban, kayan lantarki, kayan aikin sarrafa kansa, kayan sadarwa, na'urorin lantarki, kayan aikin wuta da sauran fannoni.
Ku rubuta sakonku anan ku aiko mana
