HK-14-16AP-1118
dpdt micro switch / combined sealed micro switches / 16a dpdt double combined micro switch
| The defining characteristics of operation | Operating Parameter | Value | Units |
 |
Free Position FP | 15.9±0.2 | mm |
| Operating Position OP | 14.9±0.5 | mm | |
| Releasing Position RP | 15.2±0.5 | mm | |
| Total travel Position | 13.1 | mm | |
| Operating Force OF | 0.25~4 | N | |
| Releasing Force RF | — | N | |
| Total travel Force TTF | — | N | |
| Pre Travel PT | 0.5~1.6 | mm | |
| Over Travel OT | 1.0Min | mm | |
| Movement Differential MD | 0.4Max | mm |
Switch technical Characteristics
| ITEM | technical parameter | Value | |
| 1 | Contact Resistance | ≤30mΩ Initial value | |
| 2 | Insulation Resistance | ≥100MΩ500VDC | |
| 3 | Dielectric Voltage | between non-connected terminals | 1000V/0.5mA/60S |
| between terminals and the metal frame | 3000V/0.5mA/60S | ||
| 4 | Electrical Life | ≥50000 cycles | |
| 5 | Mechanical Life | ≥1000000 cycles | |
| 6 | Operating Temperature | -25~125℃ | |
| 7 | Operating Frequency | electrical:15 cycles Mechanical:60 cycles |
|
| 8 | Vibration Proof | Vibration Frequency:10~55HZ; Amplitude:1.5mm; Three directions:1H |
|
| 9 | Solder Ability: More than 80% of immersed part shall be covered with solder | Soldering Temperature:235±5℃ Immersing Time:2~3S |
|
| 10 | Solder Heat Resistance | Dip Soldering:260±5℃ 5±1S Manual Soldering:300±5℃ 2~3S |
|
| 11 | Safety Approvals | UL,CSA,VDE,ENEC,TUV,CE,KC,CQC | |
| 12 | Test Conditions | Ambient Temperature:20±5℃ Relative Humidity:65±5%RH Air Pressure:86~106KPa |
|
Switch application: widely used in various household appliances, electronic equipment, automation equipment, communication equipment, automotive electronics, power tools and other fields.
Precautions for power switch layout
Power switch: Regarding the precautions for the layout and wiring of the power switch, I will share with you the precautions for the layout and wiring of the switching power supply in our design.
Precautions for power switch layout
First of all, I still borrowed the priority points mentioned by many high-speed fans. Regardless of whether it is layout or wiring priority, please refer to the chip data sheet. The general manual will give a layout guide description:
At this time, how should we weigh our design? In the usual power switch design, there are still some design experience that can be used for reference.
Step: Determine the position of the power switch module on the PCB board. The switch is a powerful source of EMI radiation. When placing it, it should be far away from sensitive components such as clocks and interfaces, and then as close as possible to our electrical terminals, taking into account factors such as heat dissipation and assembly.
Step 2: Determine the difference between the main power switch channel and the ground (power ground, signal ground and other signal grounds), the main current channel (red); ground difference (rose red and cyan); feedback channel (blue)
Three steps: the core components of each part: the placement of the input filter, switch tube, control circuit, and output filter components.
Switch tube: The layout is compact, the layout considers the high current channel, and the input and output grounds can be directly connected.
Input filtering: close to the switch tube to ensure that large currents can be filtered out before entering the switch tube
Output filtering: Close to the switch tube to ensure that large currents are filtered out before entering the single board plane.
Input and output circuit: MOS tube loop, freewheeling tube loop as small as possible.
Power switch control circuit:
(1) The comparison circuit of the control circuit is placed close to the control chip;
(2) For the sampling circuit of the control circuit, the sampling resistor is placed between the output filter and the comparison circuit. When laying out, make sure that the sampling circuit is as close as possible to the chip pins and close to the comparison circuit;
(3) For the filter network of the control circuit itself, the capacitor should be as close as possible to the corresponding pin; and the related control signal equipment should be as close as possible to the chip.
Tongda Wire Electric Factory focuses on the production and sales of micro switches, waterproof micro switches, automotive micro switches, power switches, rotary switches and other products. The main products are micro switch series, waterproof switch series, rotary switch series and so on. Tongda products have obtained UL/CUL certification in the United States, VDE/TUV certification in Germany, four Nordic certifications, EK/KTL certification in South Korea and CQC certification in China; the products are widely used in household appliances such as televisions, soymilk machines, microwave ovens, juice machines, etc. For automobiles and electronic instruments, the annual production capacity is more than 100 million switches. The company implements strict quality control, continuously improves product quality, and provides customers with competitive products and satisfactory services. Welcome to consult.
