DK4-BZ-007
(Definiendi notas operationis) | (Parameter Operans) | (Abbreviatio) | (unitates) |
| (Free Position) | FP | mm |
(Opering Position) | OP | mm | |
(Locus solventes) | RP | mm | |
(Total peregrinatione Position) | TTP | mm | |
(Operans Force) | OF | N | |
(Vis Dimittentes) | RF | N | |
(Tota vis itinerantur) | TTF | N | |
(Pre Travel) | PT | mm | |
(Per Travel) | OT | mm | |
(Motus Differentialis) | MD | mm |
Characteres technica switch
.ITEM. | -technical modularis. | .Precium. | |
1 | Electrical Rating) | 10(1.5)A 250VAC | |
2 | Contact Resistentia) | ≤50mΩ(Coepi valorem) | |
3 | (Resistentia Insulae) | ≥100MΩ(500VDC) | |
4 | Dielectric Voltage) | -inter terminals non connexa. | 500V/0.5mA/60S |
(Inter terminales ac metalli frame) | 1500V/0.5mA/60S | ||
5 | (Electrical Vita) | ≥10000 circuitus | |
6 | (Vita Mechanica) | ≥3000000 circuitus | |
7 | (Operating Temperature) | -25~105℃ | |
8 | Operating Frequency) | electrical):15circuitusMechanical):60circuitus | |
9 | Vibration Probatur) | Vibratio Frequency):10~55HZ; Amplitude):1.5mm; Tres partes: 1H | |
10 | (Sold Facultas): (Plus quam 80% pars immersa solida operietur) | 2~3S . 2~3S | |
11 | Solder calor Resistentia) | Dip Soldering260±5℃5±1S(Manuale Soldering300±5℃ 2~3S | |
12 | Safety Approvals) | UL、CSA、TUV、ENEC | |
13 | Test Conditions) | Ambient Temperature):20±5℃(Relativum Umor):65±5%RH Air Pressure):86~106KPa |
Epistulam tuam hic scribe et mitte nobis