DK4-BZ-007
| (Definiendi notas operationis) | (Parameter Operans) | (Abbreviatio) | (unitates) |
|
| (Free Position) | FP | mm |
| (Opering Position) | OP | mm | |
| (Locus solventes) | RP | mm | |
| (Total peregrinatione Position) | TTP | mm | |
| (Operans Force) | OF | N | |
| (Vis Dimittentes) | RF | N | |
| (Tota vis itinerantur) | TTF | N | |
| (Pre Travel) | PT | mm | |
| (Per Travel) | OT | mm | |
| (Motus Differentialis) | MD | mm |
Characteres technica switch
| .ITEM. | -technical modularis. | .Precium. | |
| 1 | Electrical Rating） | 10(1.5)A 250VAC | |
| 2 | Contact Resistentia） | ≤50mΩ(Coepi valorem) | |
| 3 | (Resistentia Insulae) | ≥100MΩ(500VDC) | |
| 4 | Dielectric Voltage） | -inter terminals non connexa. | 500V/0.5mA/60S |
| (Inter terminales ac metalli frame) | 1500V/0.5mA/60S | ||
| 5 | (Electrical Vita) | ≥10000 circuitus | |
| 6 | (Vita Mechanica) | ≥3000000 circuitus | |
| 7 | (Operating Temperature) | -25～105℃ | |
| 8 | Operating Frequency） | electrical）:15circuitusMechanical）:60circuitus | |
| 9 | Vibration Probatur） | Vibratio Frequency）：10～55HZ； Amplitude）：1.5mm; Tres partes: 1H | |
| 10 | (Sold Facultas): (Plus quam 80% pars immersa solida operietur) | 2～3S . 2～3S | |
| 11 | Solder calor Resistentia） | Dip Soldering260±5℃5±1S（Manuale Soldering300±5℃ 2～3S | |
| 12 | Safety Approvals） | UL、CSA、TUV、ENEC | |
| 13 | Test Conditions） | Ambient Temperature）：20±5℃（Relativum Umor）：65±5%RH Air Pressure）：86～106KPa | |
11
Epistulam tuam hic scribe et mitte nobis
