DK4-BZ-007
(Ny toetra mampiavaka ny asa) | (Parameter miasa) | (Fanafohy) | (Fizarana) |
| (Toerana malalaka) | FP | mm |
(Toerana miasa) | OP | mm | |
(Toerana famoahana) | RP | mm | |
(Toerana toerana fitsangatsanganana) | TTP | mm | |
(Hery miasa) | OF | N | |
(Hery Famotsorana) | RF | N | |
(Total Travel Force) | TTF | N | |
(Pre Travel) | PT | mm | |
(Ny dia lavitra) | OT | mm | |
(Movement Differential) | MD | mm |
Hanova toetra ara-teknika
(zavatra) | (parameter ara-teknika) | (sarobidy) | |
1 | (Electrical Rating) | 10(1.5)A 250VAC | |
2 | (Contact Resistance) | ≤50mΩ( sanda voalohany) | |
3 | (Fitoherana insulation) | ≥100MΩ(500VDC) | |
4 | (Dielectric Voltage) | (eo anelanelan'ny terminal tsy mifandray) | 500V/0.5mA/60S |
(eo anelanelan'ny terminal sy ny frame metaly) | 1500V/0.5mA/60S | ||
5 | (Fiainana elektrika) | ≥10000 tsingerina | |
6 | (Fiainana mekanika) | ≥3000000 tsingerina | |
7 | (Temperature miasa) | -25~105℃ | |
8 | (Frequence miasa) | (elektrika): 15tsingerina(Mekanika): 60tsingerina | |
9 | (Vibration Proof) | (Frequence hovitrovitra): 10 ~ 55HZ; (Amplitude):1.5mm; (Torolalana telo):1H | |
10 | (fahaizana solder): (Mihoatra ny 80% amin'ny ampahany asitrika dia hosaronana solder) | (Temperature solder): 235±5 ℃ (Fotoana fandrobohana): 2~3S | |
11 | (Solder Heat Resistance) | (Atsoboka fametahana):260±5℃ 5±1S(Fanatsofoka tanana):300±5℃ 2~3S | |
12 | (Fankatoavana fiarovana) | UL, CSA, TUV, ENEC | |
13 | (Fepetra andrana) | (Temperature Ambient): 20 ± 5 ℃ (Hamandoana mitovitovy):65±5% RH (Tsindrin'ny rivotra):86~106KPa |
11
Soraty eto ny hafatrao ary alefaso aminay