HK-04G-1AZ-009
| (Ny toetra mampiavaka ny asa) | (Parameter miasa) | (Fanafohy) | (Fizarana) | (Sanda) |
|
| (Toerana malalaka) | FP | mm | 12.1±0.2 |
| (Toerana miasa) | OP | mm | 11.5±0.5 | |
| (Toerana famoahana) | RP | mm | 11.7±0.5 | |
| (Toerana toerana fitsangatsanganana) | TTP | mm | 10.5±0.3 | |
| (Hery miasa) | OF | N | 1.0～3.5 | |
| (Hery Famotsorana) | RF | N | - | |
| (Total Travel Force) | TTF | N | - | |
| (Pre Travel) | PT | mm | 0.3～1.0 | |
| (Ny dia lavitra) | OT | mm | 0.2 (Min) | |
| (Movement Differential) | MD | mm | 0.4 (Max) |
Hanova toetra ara-teknika
| (zavatra） | （parameter ara-teknika） | (sarobidy） | |
| 1 | (Electrical Rating) | 5(2)A 250VAC | |
| 2 | (Contact Resistance) | ≤50mΩ( sanda voalohany) | |
| 3 | (Fitoherana insulation) | ≥100MΩ(500VDC) | |
| 4 | (Dielectric Voltage) | (eo anelanelan'ny terminal tsy mifandray) | 500V/0.5mA/60S |
|
|
| (eo anelanelan'ny terminal sy ny frame metaly) | 1500V/0.5mA/60S |
| 5 | (Fiainana elektrika) | ≥10000 tsingerina | |
| 6 | (Fiainana mekanika) | ≥100000 tsingerina | |
| 7 | (Temperature miasa) | -25～125℃ | |
| 8 | (Frequence miasa) | (elektrika): 15tsingerina (Mekanika): 60tsingerina | |
| 9 | (Vibration Proof) | (Frequence hovitrovitra): 10 ~ 55HZ; （Amplitude）：1.5mm; （Torolalana telo）:1H | |
| 10 | (fahaizana solder): (Mihoatra ny 80% amin'ny ampahany asitrika dia hosaronana solder) | (Soldering maripana): 235±5 ℃ (Fotoana asitrika):2～3S | |
| 11 | (Solder Heat Resistance) | （Atsoboka solder）：260±5℃ 5±1S （Fametahana manual）：300±5℃ 2～3S | |
| 12 | （Fankatoavana fiarovana） | UL, CSA, VDE, ENEC, CE | |
| 13 | (Fepetra andrana) | (Temperature Ambient): 20±5 ℃ (Hamandoana hamandoana): 65±5% RH (Tsindrin'ny rivotra):86～106KPa | |
Soraty eto ny hafatrao ary alefaso aminay
