HK-04G AD
Miova toetra toetra
Ny toetra mamaritra ny asa | Paramètre miasa | fanafohezana | vondrona | sarobidy |
toerana malalaka | FP | mm | 12.1±0.2 | |
Toerana miasa | OP | mm | 11.5±0.5 | |
Famoahana toerana | RP | mm | 11.7±0.5 | |
Toerana fitsangatsanganana manontolo | TTP | mm | 10.7 | |
Hery miasa | OF | N | 1.0~3.5 | |
Hery fanafahana | RF | N | - | |
Total Travel Force | TTF | N | - | |
Pre Travel | PT | mm | 0.3~1.0 | |
Over Travel | OT | mm | 0.2Min | |
Movement Differential | MD | mm | 0.4 Max |
Hanova toetra ara-teknika
zavatra | parameter ara-teknika | sarobidy | |
1 | Rating elektrika | 5A/10A 250VAC | |
2 | Contact Resistance | ≤50mΩSanda voalohany | |
3 | Insulation fanoherana | ≥100MΩ500VDC | |
4 | Dielectric Voltage | eo anelanelan'ny terminal tsy mifandray | 500V/0.5mA/60S |
eo anelanelan'ny terminal sy ny frame metaly | 1500V/0.5mA/60S | ||
5 | Fiainana elektrika | ≥10000 tsingerina | |
6 | Fiainana mekanika | ≥100000 tsingerina | |
7 | Temperature miasa | 0~125 ℃ | |
8 | Frequency miasa | elektrika: 15tsingerinaMekanika: 60tsingerina | |
9 | Vibration Proof | Vibration matetika: 10 ~ 55HZ; Amplitude: 1.5mm; Tari-dalana telo: 1H | |
10 | Fahaiza-manao solder: Mihoatra ny 80% amin'ny ampahany asitrika dia hosaronana solder | Soldering mari-pana: 235 ± 5 ℃ immersing fotoana: 2 ~ 3S | |
11 | Solder hafanana fanoherana | Atsoboka soldering: 260±5 ℃ 5±1SManual soldering: 300±5 ℃ 2~3S | |
12 | Fankatoavana fiarovana | UL, CSA, VDE, ENEC, CE | |
13 | Fepetra fitsapana | Ambient mari-pana: 20±5 ℃ Relative Hamandoana: 65±5% RH Tosi-drivotra: 86~106KPa |
Fampiharana Switch: ampiasaina betsaka amin'ny fitaovana isan-tokantrano, fitaovana elektronika, fitaovana automatique, fitaovam-pifandraisana, elektronika fiara, fitaovana herinaratra ary sehatra hafa.
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Soraty eto ny hafatrao ary alefaso aminay