HK-14-1X-16AP-855
| Ny toetra mampiavaka ny fandidiana | Paramètre miasa | sarobidy | vondrona |
 | Free Position FP | 15.9±0.2 | mm |
| Toerana miasa OP | 14.9±0.5 | mm | |
| Famoahana toerana RP | 15.2±0.5 | mm | |
| Toerana fitsangatsanganana manontolo | 13.1 | mm | |
| Hery miasa OF | 0.25–4 | N | |
| Famoahana Force RF | - | N | |
| Total Travel Force TTF | - | N | |
| Pre Travel PT | 0.5–1.6 | mm | |
| Over Travel OT | 1.0Min | mm | |
| Movement Differential MD | 0.4 Max | mm |
Hanova toetra ara-teknika
| zavatra | parameter ara-teknika | sarobidy | |
| 1 | Contact Resistance | ≤30mΩ sanda voalohany | |
| 2 | Insulation fanoherana | ≥100MΩ500VDC | |
| 3 | Dielectric Voltage | eo anelanelan'ny terminal tsy mifandray | 1000V/0.5mA/60S |
| eo anelanelan'ny terminal sy ny frame metaly | 3000V/0.5mA/60S | ||
| 4 | Fiainana elektrika | ≥50000 tsingerina | |
| 5 | Fiainana mekanika | ≥1000000 tsingerina | |
| 6 | Temperature miasa | -25~125 ℃ | |
| 7 | Frequency miasa | elektrika: 15 cycles Mekanika: 60 cycles | |
| 8 | Vibration Proof | Vibration matetika: 10 ~ 55HZ; Amplitude: 1.5mm; Tari-dalana telo: 1H | |
| 9 | Fahaiza-manao solder: Mihoatra ny 80% amin'ny ampahany asitrika dia hosaronana solder | Soldering mari-pana: 235±5 ℃ Fotoana asitrika: 2~3S | |
| 10 | Solder hafanana fanoherana | Atsoboka soldering: 260±5℃ 5±1S Soldering manual: 300±5 ℃ 2 ~ 3S | |
| 11 | Fankatoavana fiarovana | UL,CSA,VDE,ENEC,TUV,CE,KC,CQC | |
| 12 | Fepetra fitsapana | Ambient mari-pana: 20±5 ℃ Hamandoana havany: 65±5% RH Tosi-drivotra: 86~106KPa | |
Fampiharana Switch: ampiasaina betsaka amin'ny fitaovana isan-tokantrano, fitaovana elektronika, fitaovana automatique, fitaovam-pifandraisana, elektronika fiara, fitaovana herinaratra ary sehatra hafa.
Soraty eto ny hafatrao ary alefaso aminay
