HK-14-16AP-605
| Nga ahuatanga tautuhi o te mahi | Tawhā Mahi | Uara | Waeine |
 | Tūnga Free FP | 15.9±0.2 | mm |
| Turanga Mahi OP | 14.9±0.5 | mm | |
| Te Tukunga Turanga RP | 15.2±0.5 | mm | |
| Turanga haerenga katoa | 13.1 | mm | |
| Ope Whakahaere O | 0.25~4 | N | |
| Te tuku i te Force RF | — | N | |
| Tapeke haere Force TTF | — | N | |
| Tuhinga o mua PT | 0.5~1.6 | mm | |
| Neke atu i te Haerenga OT | 1.0Min | mm | |
| Movement Different MD | 0.4Mōrahi | mm |
Hurihia nga ahuatanga hangarau
| ITEM | tawhā hangarau | Uara | |
| 1 | Whakapā Atete | ≤30mΩ Uara tuatahi | |
| 2 | Ātete Wehenga | ≥100MΩ500VDC | |
| 3 | Ngaohiko Dielectric | i waenganui i nga kapeka hono-kore | 1000V/0.5mA/60S |
| i waenganui i nga pito me te anga whakarewa | 3000V/0.5mA/60S | ||
| 4 | Te Ora Hiko | ≥50000 huringa | |
| 5 | Te Ora Miihini | ≥1000000 huringa | |
| 6 | Te Waahi Mahi | -25~125 ℃ | |
| 7 | Auau Mahi | hiko:15 huringa Hangaia: 60 huringa | |
| 8 | Tohu Wiri | Auautanga Wiri:10~55HZ; Amplitude:1.5mm; E toru nga ahunga:1H | |
| 9 | Te kaha o te Solder: Neke atu i te 80% o te wahanga ruku ka hipokina ki te solder | Te Mahana Whakakotahi: 235±5 ℃ Wā Rūmaki: 2~3S | |
| 10 | Te Atete Wea Hoahoa | Tou Soldering:260±5℃ 5±1S Whakakotahi a-ringa:300±5℃ 2~3S | |
| 11 | Whakaaetanga Haumaru | UL,CSA,VDE,ENEC,TUV,CE,KC,CQC | |
| 12 | Nga Tikanga Whakamatau | Te Paemahana Ambient: 20±5 ℃ Haumākū Pātahi:65±5%RH Te Hau: 86 ~ 106KPa | |
Whakawhiti tono: whakamahia nuitia i roto i nga momo taputapu whare, taputapu hiko, taputapu aunoa, taputapu korero, hiko hiko, taputapu hiko me etahi atu mara.
Tuhia to korero ki konei ka tukuna mai ki a matou
