HK-14-16AP-605
| Kufotokozera za ntchito | Ntchito Parameter | Mtengo | Mayunitsi |
 | Free Position FP | 15.9±0.2 | mm |
| Operating Position OP | 14.9±0.5 | mm | |
| Kutulutsa Position RP | 15.2±0.5 | mm | |
| Total Travel Position | 13.1 | mm | |
| Mphamvu Yogwira Ntchito YA | 0.25-4 | N | |
| Kutulutsa Mphamvu RF | - | N | |
| Total Travel Force TTF | - | N | |
| Zolemba za Pre Travel PT | 0.5-1.6 | mm | |
| Pa Travel OT | 1.0Min | mm | |
| Movement Differential MD | 0.4 Max | mm |
Sinthani Makhalidwe Aukadaulo
| ITEM | ukadaulo parameter | Mtengo | |
| 1 | Contact Resistance | ≤30mΩ Mtengo woyambira | |
| 2 | Kukana kwa Insulation | ≥100MΩ500VDC | |
| 3 | Dielectric Voltage | pakati pa ma terminals osalumikizidwa | 1000V/0.5mA/60S |
| pakati pa ma terminals ndi chimango chachitsulo | 3000V/0.5mA/60S | ||
| 4 | Moyo Wamagetsi | ≥50000 kuzungulira | |
| 5 | Moyo Wamakina | ≥1000000 kuzungulira | |
| 6 | Kutentha kwa Ntchito | -25 ~ 125 ℃ | |
| 7 | Maulendo Ogwira Ntchito | magetsi:15 kuzungulira Zimango: 60 kuzungulira | |
| 8 | Umboni Wogwedezeka | Kuthamanga Kwambiri: 10 ~ 55HZ; matalikidwe: 1.5mm; Njira zitatu: 1H | |
| 9 | Kuthekera kwa Solder: Kupitilira 80% ya gawo lomizidwa lidzakutidwa ndi solder | Kutentha kwa Soldering: 235 ± 5 ℃ Nthawi Yomiza:2-3S | |
| 10 | Kulimbana ndi Kutentha kwa Solder | Dip Soldering:260±5℃ 5±1S Kuwotchera pamanja:300±5℃ 2~3S | |
| 11 | Zovomerezeka Zachitetezo | UL,CSA,VDE,ENEC,TUV,CE,KC,CQC | |
| 12 | Zoyeserera | Kutentha kozungulira:20 ± 5 ℃ Chinyezi Chachibale: 65 ± 5% RH Kuthamanga kwa Air: 86 ~ 106KPa | |
Switch application: imagwiritsidwa ntchito kwambiri pazida zosiyanasiyana zapakhomo, zida zamagetsi, zida zamagetsi, zida zoyankhulirana, zamagetsi zamagalimoto, zida zamagetsi ndi magawo ena.
Lembani uthenga wanu apa ndikutumiza kwa ife
