HK-14-1X-16AP-855
| Izvo zvinotsanangura maitiro ekushanda | Operating Parameter | Value | Units |
 | Yemahara Position FP | 15.9±0.2 | mm |
| Operating Position OP | 14.9±0.5 | mm | |
| Kuburitsa Position RP | 15.2±0.5 | mm | |
| Total travel Position | 13.1 | mm | |
| Operating Force OF | 0.25~4 | N | |
| Kusunungura Simba RF | - | N | |
| Yese yekufamba Force TTF | - | N | |
| Pre Travel PT | 0.5~1.6 | mm | |
| Pamusoro peKufamba OT | 1.0Min | mm | |
| Movement Differential MD | 0.4Max | mm |
Chinja technical Characteristics
| ITEM | technical parameter | Value | |
| 1 | Bata Resistance | ≤30mΩ kukosha kwekutanga | |
| 2 | Insulation Resistance | ≥100MΩ500VDC | |
| 3 | Dielectric Voltage | pakati pezvisina kubatanidzwa zviteshi | 1000V/0.5mA/60S |
| pakati pematerminals nesimbi frame | 3000V/0.5mA/60S | ||
| 4 | Upenyu hweMagetsi | ≥50000 kutenderera | |
| 5 | Mechanical Life | ≥1000000 kutenderera | |
| 6 | Operating Temperature | -25 ~ 125 ℃ | |
| 7 | Operating Frequency | zvemagetsi:15 kutenderera Mechanical: 60 kutenderera | |
| 8 | Vibration Uchapupu | Vibration Frequency: 10 ~ 55HZ; Amplitude: 1.5mm; Nheyo nhatu:1H | |
| 9 | Solder Ability: Inopfuura 80% yechikamu chakanyudzwa ichavharwa ne solder | Soldering Tembiricha:235±5℃ Nguva Yekunyudza:2~3S | |
| 10 | Solder Heat Resistance | Dip Soldering:260±5℃ 5±1S Manual Soldering:300±5℃ 2~3S | |
| 11 | Zvibvumirano Zvekuchengetedza | UL,CSA,VDE,ENEC,TUV,CE,KC,CQC | |
| 12 | Test Conditions | Ambient Tembiricha:20±5℃ Hukama Humidity:65±5%RH Mhepo Dzvinyiriro:86 ~ 106KPa | |
Chinja application: inoshandiswa zvakanyanya mumidziyo yakasiyana yemumba, midziyo yemagetsi, otomatiki midziyo, midziyo yekutaurirana, zvemagetsi zvemotokari, maturusi emagetsi nemimwe minda.
Nyora meseji yako pano ugotitumira
