DK4-BZ-019
| (Litšobotsi tse hlalosang ts'ebetso) | (Parameter e sebetsang) | (Khutsufatso) | (Diyuniti) |
|
| (Maemo a Mahala) | FP | mm |
| (Boemo ba Ts'ebetso) | OP | mm | |
| (Boemo ba ho Lokolla) | RP | mm | |
| (Kakaretso ea Maeto) | TTP | mm | |
| (Operating Force) | OF | N | |
| (Releasing Force) | RF | N | |
| (Total travel Force) | TTF | N | |
| (Maeto a Pele) | PT | mm | |
| (Maeto a Felletseng) | OT | mm | |
| (Movement Differential) | MD | mm |
Fetola Litšobotsi tsa tekheniki
| （ITEM） | (parameter ea tekheniki) | （Boleng） | |
| 1 | (Tlhahiso ea Motlakase) | 10(1.5)A 250VAC | |
| 2 | (Contact Resistance) | ≤50mΩ( Boleng ba pele) | |
| 3 | (Insulation Resistance) | ≥100MΩ(500VDC) | |
| 4 | (Dielectric Voltage) | (pakeng tsa li-terminals tse sa hokahaneng) | 500V/0.5mA/60S |
| (pakeng tsa li-terminals le foreimi ea tšepe) | 1500V/0.5mA/60S | ||
| 5 | (Bophelo ba Motlakase) | ≥10000 lipotoloho | |
| 6 | (Bophelo ba Mechini) | ≥3000000 lipotoloho | |
| 7 | (Mocheso oa ho sebetsa) | -25℃105℃ | |
| 8 | (Makhetlo a ho sebetsa) | (motlakase):15lipotoloho(Mechini):60lipotoloho | |
| 9 | (Bopaki ba Vibration) | (Makhetlo a Vibration): 10 ~ 55HZ; (Amplitude): 1.5mm; (Litsela tse tharo): 1H | |
| 10 | (Bokhoni ba Solder): (Ho feta 80% ea karolo e qoelitsoeng e tla koaheloa ka solder) | (Mocheso oa Soldering): 235±5℃(Nako ea ho qoelisoa):2～3S | |
| 11 | (Solder Heat Resistance) | (Dip Soldering): 260±5℃ 5±1S(Manual Soldering):300±5℃ 2～3S | |
| 12 | (Litumello tsa Tšireletso) | UL, CSA, TUV,ENEC | |
| 13 | (Maemo a Teko) | (Ambient Mocheso):20±5℃ (Mongobo o Relative):65±5%RH (Khatello ea Moea): 86 ~ 106KPa | |
11
Ngola molaetsa wa hao mona mme o re romele wona
