ITEM）

(parameter ea tekheniki)

（Boleng）

1

(Tlhahiso ea Motlakase)

0.1A 250VAC

2

(Operating Force)

1.0–2.5N

3

(Contact Resistance)

≤300mΩ

4

(Insulation Resistance)

≥100MΩ(500VDC)

5

(Dielectric Voltage)

(pakeng tsa li-terminals tse sa hokahaneng)

500V/0.5mA/60S

(pakeng tsa li-terminals le foreimi ea tšepe)

1500V/0.5mA/60S

6

(Bophelo ba Motlakase)

≥50000 lipotoloho

7

(Bophelo ba Mechini)

≥100000 lipotoloho

8

(Mocheso oa ho sebetsa)

-25℃105℃

9

(Makhetlo a ho sebetsa)

(motlakase):15lipotoloho(Mechini):60lipotoloho

10

(Bopaki ba Vibration)

(Makhetlo a Vibration): 10 ~ 55HZ; (Amplitude): 1.5mm; (Litsela tse tharo): 1H

11

(Bokhoni ba Solder)(Ho feta 80% ea karolo e qoelitsoeng e tla koaheloa ka solder)

(Mocheso oa Soldering): 235±5℃(Nako ea ho qoelisoa):2～3S

12

(Solder Heat Resistance)

(Dip Soldering):260±5℃ 5±1SManual Soldering）:300±5℃ 2～3S

13

(Maemo a Teko)

(Ambient Mocheso):20±5℃ (Mongobo o Relative）:65±5%RH(Khatello ea Moea):86～106KPa