HK-04G-1AZ-029
| (Litšobotsi tse hlalosang ts'ebetso) | (Parameter e sebetsang) | (Khutsufatso) | (Diyuniti) | (Boleng) |
|
| (Maemo a Mahala) | FP | mm | 12.1±0.2 |
| (Boemo ba Ts'ebetso) | OP | mm | 11.5±0.5 | |
| (Boemo ba ho Lokolla) | RP | mm | 11.7±0.5 | |
| (Kakaretso ea Maeto) | TTP | mm | 10.5±0.3 | |
| (Operating Force) | OF | N | 1.0–3.5 | |
| (Releasing Force) | RF | N | - | |
| (Total travel Force) | TTF | N | - | |
| (Maeto a Pele) | PT | mm | 0.3–1.0 | |
| (Maeto a Felletseng) | OT | mm | 0.2(Metsotso) | |
| (Movement Differential) | MD | mm | 0.4(Boholo) |
Fetola Litšobotsi tsa tekheniki
| （ITEM） | (parameter ea tekheniki) | （Boleng） | |
| 1 | (Tlhahiso ea Motlakase) | 5(2)A 250VAC | |
| 2 | (Contact Resistance) | ≤50mΩ( Boleng ba pele) | |
| 3 | (Insulation Resistance) | ≥100MΩ(500VDC) | |
| 4 | (Dielectric Voltage) | (pakeng tsa li-terminals tse sa hokahaneng) | 500V/0.5mA/60S |
|
|
| (pakeng tsa li-terminals le foreimi ea tšepe) | 1500V/0.5mA/60S |
| 5 | (Bophelo ba Motlakase) | ≥10000 lipotoloho | |
| 6 | (Bophelo ba Mechini) | ≥100000 lipotoloho | |
| 7 | (Mocheso oa ho sebetsa) | -25℃125℃ | |
| 8 | (Makhetlo a ho sebetsa) | (motlakase):15lipotoloho (Mechini):60lipotoloho | |
| 9 | (Bopaki ba Vibration) | (Makhetlo a Vibration): 10 ~ 55HZ; (Amplitude): 1.5mm; (Litsela tse tharo): 1H | |
| 10 | (Bokhoni ba Solder): (Ho feta 80% ea karolo e qoelitsoeng e tla koaheloa ka solder) | (Mocheso oa Soldering): 235±5℃ (Nako ea ho qoelisoa):2～3S | |
| 11 | (Solder Heat Resistance) | (Dip Soldering): 260±5℃ 5±1S (Soldering ka Manual):300±5℃ 2～3S | |
| 12 | (Litumello tsa Tšireletso) | UL, CSA, VDE, ENEC, CE | |
| 13 | (Maemo a Teko) | (Mocheso o Tletseng): 20±5℃ (Mongobo o lekanyelitsoeng): 65±5%RH (Khatello ea Moea): 86 ~ 106KPa | |
Ngola molaetsa wa hao mona mme o re romele wona
