HK-04G AD
Fetola ketso Litšobotsi
| Litšobotsi tse hlalosang ts'ebetso | Parameter e sebetsang | Kgutsufatso | Diyuniti | Boleng |
 | Maemo a Mahala | FP | mm | 12.1±0.2 |
| Boemo ba ho sebetsa | OP | mm | 11.5±0.5 | |
| Ho Lokolla Boemo | RP | mm | 11.7±0.5 | |
| Total travel Position | TTP | mm | 10.7 | |
| Matla a Tshebetso | OF | N | 1.0~3.5 | |
| Ho Lokolla Matla | RF | N | - | |
| Total travel Force | TTF | N | - | |
| Ho Eta Pele | PT | mm | 0.3~1.0 | |
| Ho Feta Maeto | OT | mm | 0.2Metsotso | |
| Phapang ea Motsamao | MD | mm | 0.4Boholo |
Fetola Litšobotsi tsa tekheniki
| ITEM | parameter ea tekheniki | Boleng | |
| 1 | Tekanyetso ea Motlakase | 5A/10A 250VAC | |
| 2 | Ikopanye le Resistance | ≤50mΩBoleng ba pele | |
| 3 | Khanyetso ea Insulation | ≥100MΩ500VDC | |
| 4 | Dielectric Voltage | pakeng tsa li-terminals tse sa amaneng | 500V/0.5mA/60S |
| pakeng tsa ditheminale le foreime ya tshepe | 1500V/0.5mA/60S | ||
| 5 | Bophelo ba Motlakase | ≥10000 lipotoloho | |
| 6 | Bophelo ba Mechini | ≥100000 lipotoloho | |
| 7 | Mocheso oa ho sebetsa | 0 ~ 125℃ | |
| 8 | Maqhubu a Tshebetso | motlakase:15lipotolohoMechini:60lipotoloho | |
| 9 | Bopaki ba Vibration | Maqhubu a ho sisinyeha: 10 ~ 55HZ; Boima: 1.5mm; Litsela tse tharo: 1H | |
| 10 | Bokhoni ba Solder: Ho feta 80% ea karolo e qoelitsoeng e tla koaheloa ka solder | Mocheso oa Soldering:235±5℃Nako ea ho qoelisoa:2~3S | |
| 11 | Solder Heat Resistance | Dip Soldering:260±5℃ 5±1SManual Soldering:300±5℃ 2~3S | |
| 12 | Litumello tsa Tšireletseho | UL,CSA,VDE,ENEC,CE | |
| 13 | Maemo a Teko | Ambient Mocheso:20±5℃Leloko Mongobo: 65±5%RH Khatello ea Moea: 86 ~ 106KPa | |
Sesebelisoa sa switch: se sebelisoa haholo lisebelisoa tse fapaneng tsa ntlo, lisebelisoa tsa elektroniki, lisebelisoa tsa othomathike, lisebelisoa tsa puisano, lisebelisoa tsa elektroniki tsa likoloi, lisebelisoa tsa motlakase le likarolo tse ling.
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Ngola molaetsa wa hao mona mme o re romele wona
