HK-04G-LZ-230

mushroom hlooho chitja konopo micro switjha 5A 250V UL VDE Snap Action switjha T125

Hona joale: 1(0.3)A, 3(1)A, 5(2)A, 10(3)A
Matla: AC 125V/250V, DC 12V/24V
E amohetsoe: UL,cUL(CSA),VDE,ENEC,CQC


HK-04G-LZ-230

Li-tag tsa Sehlahisoa

Litšobotsi tsa Theknoloji

(Litšobotsi tse hlalosang ts'ebetso)

(Parameter e sebetsang)

(Khutsufatso)

(Diyuniti)

(Boleng)

 pd

(Maemo a Mahala)

FP

mm

12.1±0.2

(Boemo ba Ts'ebetso)

OP

mm

11.5±0.5

(Boemo ba ho Lokolla)

RP

mm

11.7±0.5

(Kakaretso ea Maeto)

TTP

mm

10.5±0.3

(Operating Force)

OF

N

1.0–3.5

(Releasing Force)

RF

N

-

(Total travel Force)

TTF

N

-

(Maeto a Pele)

PT

mm

0.3–1.0

(Maeto a Felletseng)

OT

mm

0.2(Metsotso)

(Movement Differential)

MD

mm

0.4(Boholo)

(NTHO)

(parameter ea tekheniki)

(Boleng)

1

(Tlhahiso ea Motlakase) 5(2)A 250VAC

2

(Contact Resistance) ≤50mΩ( Boleng ba pele)

3

(Insulation Resistance) ≥100MΩ(500VDC)

4

(Dielectric Voltage) (pakeng tsa li-terminals tse sa hokahaneng) 500V/0.5mA/60S
(pakeng tsa li-terminals le foreimi ea tšepe) 1500V/0.5mA/60S

5

(Bophelo ba Motlakase) ≥10000 lipotoloho

6

(Bophelo ba Mechini) ≥100000 lipotoloho

7

(Mocheso oa ho sebetsa) -25℃125℃

8

(Makhetlo a ho sebetsa) (Motlakase): Lipotoloho tse 15 (Mechanical): Lipotoloho tse 60

9

(Bopaki ba Vibration)

(Makhetlo a Vibration): 10 ~ 55HZ;

(Amplitude): 1.5mm;

(Litsela tse tharo): 1H

10

(Bokhoni ba Solder): (Ho feta 80% ea karolo e qoelitsoeng e tla koaheloa ka solder) (Mocheso oa Soldering): 235±5℃(Nako ea ho qoelisoa):2~3S

11

(Solder Heat Resistance) (Dip Soldering): 260±5℃ 5±1S(Manual Soldering):300±5℃ 2~3S

12

(Litumello tsa Tšireletso)

UL, CSA, VDE, ENEC, CE

13

(Maemo a Teko) (Ambient Mocheso):20±5℃ (Mongobo o Relative):65±5%RH

(Khatello ea Moea): 86 ~ 106KPa


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  • E 'ngoe:

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