HK-04G-LZ-230
mushroom hlooho chitja konopo micro switjha 5A 250V UL VDE Snap Action switjha T125
Litšobotsi tsa Theknoloji
(Litšobotsi tse hlalosang ts'ebetso) | (Parameter e sebetsang) | (Khutsufatso) | (Diyuniti) | (Boleng) |
(Maemo a Mahala) | FP | mm | 12.1±0.2 | |
(Boemo ba Ts'ebetso) | OP | mm | 11.5±0.5 | |
(Boemo ba ho Lokolla) | RP | mm | 11.7±0.5 | |
(Kakaretso ea Maeto) | TTP | mm | 10.5±0.3 | |
(Operating Force) | OF | N | 1.0–3.5 | |
(Releasing Force) | RF | N | - | |
(Total travel Force) | TTF | N | - | |
(Maeto a Pele) | PT | mm | 0.3–1.0 | |
(Maeto a Felletseng) | OT | mm | 0.2(Metsotso) | |
(Movement Differential) | MD | mm | 0.4(Boholo) |
(NTHO) | (parameter ea tekheniki) | (Boleng) | |
1 | (Tlhahiso ea Motlakase) | 5(2)A 250VAC | |
2 | (Contact Resistance) | ≤50mΩ( Boleng ba pele) | |
3 | (Insulation Resistance) | ≥100MΩ(500VDC) | |
4 | (Dielectric Voltage) | (pakeng tsa li-terminals tse sa hokahaneng) | 500V/0.5mA/60S |
(pakeng tsa li-terminals le foreimi ea tšepe) | 1500V/0.5mA/60S | ||
5 | (Bophelo ba Motlakase) | ≥10000 lipotoloho | |
6 | (Bophelo ba Mechini) | ≥100000 lipotoloho | |
7 | (Mocheso oa ho sebetsa) | -25℃125℃ | |
8 | (Makhetlo a ho sebetsa) | (Motlakase): Lipotoloho tse 15 (Mechanical): Lipotoloho tse 60 | |
9 | (Bopaki ba Vibration) | (Makhetlo a Vibration): 10 ~ 55HZ; (Amplitude): 1.5mm; (Litsela tse tharo): 1H | |
10 | (Bokhoni ba Solder): (Ho feta 80% ea karolo e qoelitsoeng e tla koaheloa ka solder) | (Mocheso oa Soldering): 235±5℃(Nako ea ho qoelisoa):2~3S | |
11 | (Solder Heat Resistance) | (Dip Soldering): 260±5℃ 5±1S(Manual Soldering):300±5℃ 2~3S | |
12 | (Litumello tsa Tšireletso) | UL, CSA, VDE, ENEC, CE | |
13 | (Maemo a Teko) | (Ambient Mocheso):20±5℃ (Mongobo o Relative):65±5%RH (Khatello ea Moea): 86 ~ 106KPa |
Ngola molaetsa wa hao mona mme o re romele wona