HK-10-3A-009
Fetola Litšobotsi tsa Tekheniki
(NTHO) | (parameter ea tekheniki) | (Boleng) | |
1 | (Tlhahiso ea Motlakase) | 3A 250VAC | |
2 | (Contact Resistance) | ≤50mΩ( Boleng ba pele) | |
3 | (Insulation Resistance) | ≥100MΩ(500VDC) | |
4 | (Dielectric Voltage) | (pakeng tsa li-terminals tse sa hokahaneng) | 500V/5mA/5S |
(pakeng tsa li-terminals le foreimi ea tšepe) | 1500V/5mA/5S | ||
5 | (Bophelo ba Motlakase) | ≥10000 lipotoloho | |
6 | (Bophelo ba Mechini) | ≥1000000 lipotoloho | |
7 | (Mocheso oa ho sebetsa) | -25℃85℃ | |
8 | (Makhetlo a ho sebetsa) | (Motlakase): Lipotoloho tse 15 (Mechanical): Lipotoloho tse 60 | |
9 | (Bopaki ba Vibration) | (Maqhubu a ho sisinyeha): 10~55HZ; (Amplitude): 1.5mm; (Litsela tse tharo): 1H | |
10 | (Bokhoni ba Solder): (Ho feta 80% ea karolo e qoelitsoeng e tla koaheloa ka solder) | (Mocheso oa Soldering): 235±5℃(Nako ea ho qoelisoa):2~3S | |
11 | (Solder Heat Resistance) | (Dip Soldering): 260±5℃ 5±1S(Manual Soldering):300±5℃ 2~3S | |
12 | (Litumello tsa Tšireletso) | UL, CQC, TUV, CE | |
13 | (Maemo a Teko) | (Mocheso o Tletseng): 20±5℃ (Mongobo o Relative):65±5%RH (Khatello ea Moea): 86 ~ 106KPa |
Ngola molaetsa wa hao mona mme o re romele wona