HK-14-1-16A-123
Fetola ketso Litšobotsi
Litšobotsi tse hlalosang ts'ebetso | Parameter e sebetsang | Boleng | Diyuniti |
Maemo a MahalaFP | 15.9±0.2 | mm | |
Boemo ba ho sebetsaOP | 14.9±0.5 | mm | |
Ho Lokolla BoemoRP | 15.2±0.5 | mm | |
Total travel Position | 13.1 | mm | |
Matla a TshebetsoOF | 0.25~4 | N | |
Ho Lokolla MatlaRF | - | N | |
Total travel ForceTTF | - | N | |
Ho Eta PelePT | 0.5 ~ 1.6 | mm | |
Ho Feta MaetoOT | 1.0Metsotso | mm | |
Phapang ea MotsamaoMD | 0.4Boholo | mm |
Fetola Litšobotsi tsa tekheniki
ITEM | parameter ea tekheniki | Boleng | |
1 | Ikopanye le Resistance | ≤30mΩ Boleng ba pele | |
2 | Khanyetso ea Insulation | ≥100MΩ500VDC | |
3 | Dielectric Voltage | pakeng tsa li-terminals tse sa amaneng | 1000V/0.5mA/60S |
pakeng tsa ditheminale le foreime ya tshepe | 3000V/0.5mA/60S | ||
4 | Bophelo ba Motlakase | ≥50000 lipotoloho | |
5 | Bophelo ba Mechini | ≥1000000 lipotoloho | |
6 | Mocheso oa ho sebetsa | -25 ~ 125 ℃ | |
7 | Maqhubu a Tshebetso | motlakase:15lipotoloho Mechini:60lipotoloho | |
8 | Bopaki ba Vibration | Maqhubu a Vibration: 10 ~ 55HZ; Boima: 1.5mm; Litsela tse tharo: 1H | |
9 | Bokhoni ba Solder: Ho feta 80% ea karolo e qoelitsoeng e tla koaheloa ka solder | Mocheso oa Soldering:235±5℃ Nako ea ho qoelisoa: 2-3S | |
10 | Solder Heat Resistance | Dip Soldering:260±5℃ 5±1S Soldering ka letsoho:300±5℃ 2~3S | |
11 | Litumello tsa Tšireletseho | UL,CSA,VDE,ENEC,TUV,CE,KC,CQC | |
12 | Maemo a Teko | Ambient Mocheso:20±5℃ Mongobo o Batlang: 65±5%RH Khatello ea Moea: 86 ~ 106KPa |
Sesebelisoa sa switch: se sebelisoa haholo lisebelisoa tse fapaneng tsa ntlo, lisebelisoa tsa elektroniki, lisebelisoa tsa othomathike, lisebelisoa tsa puisano, lisebelisoa tsa elektroniki tsa likoloi, lisebelisoa tsa motlakase le likarolo tse ling.
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Ngola molaetsa wa hao mona mme o re romele wona