HK-14-16AP-685
| Litšobotsi tse hlalosang ts'ebetso | Parameter e sebetsang | Boleng | Diyuniti |
 | Boemo ba mahala FP | 15.9±0.2 | mm |
| Operating Position OP | 14.9±0.5 | mm | |
| Ho lokolla Boemo RP | 15.2±0.5 | mm | |
| Total travel Position | 13.1 | mm | |
| Operating Force OF | 0.25~4 | N | |
| Ho lokolla Force RF | - | N | |
| Total travel Force TTF | - | N | |
| Pele ho Tsamaea PT | 0.5 ~ 1.6 | mm | |
| Ho feta leeto la OT | 1.0Metsotso | mm | |
| Movement Differential MD | 0.4Boholo | mm |
Fetola Litšobotsi tsa tekheniki
| ITEM | parameter ea tekheniki | Boleng | |
| 1 | Ikopanye le Resistance | ≤30mΩ Boleng ba pele | |
| 2 | Khanyetso ea Insulation | ≥100MΩ500VDC | |
| 3 | Dielectric Voltage | pakeng tsa li-terminals tse sa amaneng | 1000V/0.5mA/60S |
| pakeng tsa ditheminale le foreime ya tshepe | 3000V/0.5mA/60S | ||
| 4 | Bophelo ba Motlakase | ≥50000 lipotoloho | |
| 5 | Bophelo ba Mechini | ≥1000000 lipotoloho | |
| 6 | Mocheso oa ho sebetsa | -25 ~ 125 ℃ | |
| 7 | Maqhubu a Tshebetso | motlakase: lipotoloho tse 15 Mechini: lipotoloho tse 60 | |
| 8 | Bopaki ba Vibration | Maqhubu a Vibration: 10 ~ 55HZ; Boima: 1.5mm; Litsela tse tharo: 1H | |
| 9 | Bokhoni ba Solder: Ho feta 80% ea karolo e qoelitsoeng e tla koaheloa ka solder | Mocheso oa Soldering:235±5℃ Nako ea ho qoelisoa: 2-3S | |
| 10 | Solder Heat Resistance | Dip Soldering:260±5℃ 5±1S Soldering ka letsoho:300±5℃ 2~3S | |
| 11 | Litumello tsa Tšireletseho | UL,CSA,VDE,ENEC,TUV,CE,KC,CQC | |
| 12 | Maemo a Teko | Ambient Mocheso:20±5℃ Mongobo o Batlang: 65±5%RH Khatello ea Moea: 86 ~ 106KPa | |
Sesebelisoa sa switch: se sebelisoa haholo lisebelisoa tse fapaneng tsa ntlo, lisebelisoa tsa elektroniki, lisebelisoa tsa othomathike, lisebelisoa tsa puisano, lisebelisoa tsa elektroniki tsa likoloi, lisebelisoa tsa motlakase le likarolo tse ling.
Ngola molaetsa wa hao mona mme o re romele wona
