I-DK4-BZ-007
(Iimpawu ezichazayo zokusebenza) | (Iparamitha yokuSebenza) | (Ushunqulelo) | (Iiyunithi) |
| (Indawo yasimahla) | FP | mm |
(Isikhundla sokuSebenza) | OP | mm | |
(Isikhundla sokukhulula) | RP | mm | |
(Indawo yohambo iyonke) | TTP | mm | |
(Amandla okusebenza) | OF | N | |
(Ukukhulula amandla) | RF | N | |
(Amandla ohambo ewonke) | TTF | N | |
(Uhambo lwangaphambili) | PT | mm | |
(Ngaphezu kohambo) | OT | mm | |
(Ukwahluka kwentshukumo) | MD | mm |
Tshintsha iimpawu zobugcisa
(INTO) | (Technical parameter) | (Ixabiso) | |
1 | (Umlinganiselo woMbane) | 10(1.5)A 250VAC | |
2 | (Ukuchasa uQhagamshelwano) | ≤50mΩ( Ixabiso lokuqala) | |
3 | (Ukumelana ne-Insulation) | ≥100MΩ(500VDC) | |
4 | (i-Dielectric Voltage) | (phakathi kweetheminali ezingadityaniswanga) | 500V/0.5mA/60S |
(phakathi kweetheminali kunye nesakhelo sentsimbi) | 1500V/0.5mA/60S | ||
5 | (Ubomi boMbane) | ≥10000 imijikelo | |
6 | (Ubomi boomatshini) | ≥3000000 imijikelo | |
7 | (Ubushushu bokusebenza) | -25℃105℃ | |
8 | (Izandi zokuSebenza) | (Ezombane):15imijikelo(Oomatshini):60imijikelo | |
9 | (ubungqina bokungcangcazela) | (Izandi zokungcangcazela):10~55HZ; (I-Amplitude): 1.5mm; (Imikhomba-ndlela emithathu): 1H | |
10 | (Amandla e-Solder): (Ngaphezu kwe-80% yenxalenye entywilisiweyo iya kugqunywa nge-solder) | (Ubushushu bokuSonga):235±5℃(Ixesha lokuntywiliselwa):2~3S | |
11 | (Ukumelana nobushushu beSolder) | (I-Dip Soldering):260±5℃ 5±1S(Ukusoda ngesandla):300±5℃ 2~3S | |
12 | (iiMvume zoKhuseleko) | UL, CSA, TUV,ENEC | |
13 | (Iimeko zoVavanyo) | (Ubushushu be-Ambient):20±5℃ (Ukufuma okuzalanayo):65±5%RH (Uxinzelelo loMoya):86~106KPa |
Bhala umyalezo wakho apha kwaye uwuthumele kuthi