I-DK4-BZ-007
| (Iimpawu ezichazayo zokusebenza) | (Iparamitha yokuSebenza) | (Ushunqulelo) | (Iiyunithi) |
|
| (Indawo yasimahla) | FP | mm |
| (Isikhundla sokuSebenza) | OP | mm | |
| (Isikhundla sokukhulula) | RP | mm | |
| (Indawo yohambo iyonke) | TTP | mm | |
| (Amandla okusebenza) | OF | N | |
| (Ukukhulula amandla) | RF | N | |
| (Amandla ohambo ewonke) | TTF | N | |
| (Uhambo lwangaphambili) | PT | mm | |
| (Ngaphezu kohambo) | OT | mm | |
| (Ukwahluka kwentshukumo) | MD | mm |
Tshintsha iimpawu zobugcisa
| (INTO） | (Technical parameter) | (Ixabiso） | |
| 1 | (Umlinganiselo woMbane) | 10(1.5)A 250VAC | |
| 2 | (Ukuchasa uQhagamshelwano) | ≤50mΩ( Ixabiso lokuqala) | |
| 3 | (Ukumelana ne-Insulation) | ≥100MΩ(500VDC) | |
| 4 | (i-Dielectric Voltage) | (phakathi kweetheminali ezingadityaniswanga) | 500V/0.5mA/60S |
| (phakathi kweetheminali kunye nesakhelo sentsimbi) | 1500V/0.5mA/60S | ||
| 5 | (Ubomi boMbane) | ≥10000 imijikelo | |
| 6 | (Ubomi boomatshini) | ≥3000000 imijikelo | |
| 7 | (Ubushushu bokusebenza) | -25℃105℃ | |
| 8 | (Izandi zokuSebenza) | (Ezombane):15imijikelo(Oomatshini):60imijikelo | |
| 9 | (ubungqina bokungcangcazela) | (Izandi zokungcangcazela):10～55HZ; (I-Amplitude): 1.5mm; (Imikhomba-ndlela emithathu): 1H | |
| 10 | (Amandla e-Solder): (Ngaphezu kwe-80% yenxalenye entywilisiweyo iya kugqunywa nge-solder) | (Ubushushu bokuSonga):235±5℃(Ixesha lokuntywiliselwa):2～3S | |
| 11 | (Ukumelana nobushushu beSolder) | (I-Dip Soldering):260±5℃ 5±1S(Ukusoda ngesandla):300±5℃ 2～3S | |
| 12 | (iiMvume zoKhuseleko) | UL, CSA, TUV,ENEC | |
| 13 | (Iimeko zoVavanyo) | (Ubushushu be-Ambient):20±5℃ (Ukufuma okuzalanayo):65±5%RH (Uxinzelelo loMoya):86～106KPa | |
11
Bhala umyalezo wakho apha kwaye uwuthumele kuthi
