FSK-20-001
Tshintsha iimpawu zobugcisa
INTO) | (Technical parameter) | (Ixabiso) | |
1 | (Umlinganiselo woMbane) | 0.1A 250VAC | |
2 | (Amandla okusebenza) | 1.0~2.5N | |
3 | (Ukuchasa uQhagamshelwano) | ≤300mΩ | |
4 | (Ukumelana ne-Insulation) | ≥100MΩ(500VDC) | |
5 | (i-Dielectric Voltage) | (phakathi kweetheminali ezingadityaniswanga) | 500V/0.5mA/60S |
|
| (phakathi kweetheminali kunye nesakhelo sentsimbi) | 1500V/0.5mA/60S |
6 | (Ubomi boMbane) | ≥50000 imijikelo | |
7 | (Ubomi boomatshini) | ≥100000 imijikelo | |
8 | (Ubushushu bokusebenza) | -25℃105℃ | |
9 | (Izandi zokuSebenza) | (Ezombane):15imijikelo(Oomatshini):60imijikelo | |
10 | (ubungqina bokungcangcazela) | (Izakhelo zokungcangcazela):10~55HZ; (Amplitude):1.5mm; (Imikhomba-ndlela emithathu):1H | |
11 | (Amandla e-Solder)(Ngaphezu kwe-80% yendawo entywilisiweyo iya kugqunywa ngesoda) | (Ubushushu bokuSonga):235±5℃(Ixesha lokuntywiliselwa):2~3S | |
12 | (Ukumelana nobushushu beSolder) | (Dip Soldering):260±5℃ 5±1SManual Soldering):300±5℃ 2~3S | |
13 | (Iimeko zoVavanyo) | (Ubushushu be-Ambient):20±5℃ (Ukufuma okuzalanayo):65±5%RH(Uxinzelelo loMoya):86~106KPa |
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