GNY51-1-05
Ukunciphisa iSwitch Stroke PUSH Slug Column Micro swiwi Blue 1NO 1NC ngcono kune LXW20-11
GNY51-1-05
(Tshintsha tkwezobugcisaIimpawu):
| (INTO） | (Technical parameter) | (Ixabiso） | |
| 1 | (Umlinganiselo woMbane) | 10A 250VAC | |
| 2 | (Ukuchasa uQhagamshelwano) | ≤50mΩ( Ixabiso lokuqala) | |
| 3 | (Ukumelana ne-Insulation) | ≥100MΩ(500VDC) | |
| 4 | (i-Dielectric Voltage) | (phakathi kweetheminali ezingadityaniswanga) | 500V/0.5mA/60S |
| (phakathi kweetheminali kunye nesakhelo sentsimbi) | 1500V/0.5mA/60S | ||
| 5 | (Ubomi boMbane) | ≥50000 imijikelo | |
| 6 | (Ubomi boomatshini) | ≥100000 imijikelo | |
| 7 | (Ubushushu bokusebenza) | 0℃125℃ | |
| 8 | (Izandi zokuSebenza) | (Ezombane):15imijikelo(Oomatshini):60imijikelo | |
| 9 | (ubungqina bokungcangcazela) | (Izakhelo zokungcangcazela):10～55HZ; (Amplitude):1.5mm; (Imikhomba-ndlela emithathu):1H | |
| 10 | (Amandla e-Solder): (Ngaphezu kwe-80% yenxalenye entywilisiweyo iya kugqunywa nge-solder) | (Ubushushu bokuSonga):235±5℃(Ixesha lokuntywiliselwa):2～3S | |
| 11 | (Ukumelana nobushushu beSolder) | (I-Dip Soldering):260±5℃ 5±1S(Ukusoda ngesandla):300±5℃ 2～3S | |
| 12 | (iiMvume zoKhuseleko) | UL, CSA, TUV, CQC, CE | |
| 13 | (Iimeko zoVavanyo) | (Ubushushu be-Ambient):20±5℃ (Ukufuma okuzalanayo):65±5%RH(Uxinzelelo loMoya):86～106KPa | |
Ukusetyenziswa kunye nokugcinwa
(1) Jonga iqhosha rhoqo ukususa ukungcola kulo.Ngenxa yomgama omncinci phakathi kwabafowunelwa beqhosha, emva kweminyaka emininzi yokusetyenziswa okanye isitywina asilungile, ukungena kothuli okanye izigaba ezahlukeneyo ze-emulsion yeoli ye-injini kuya kubangela ukuba ukufakwa kwe-insulation kuncitshiswe okanye nokuba yingozi yesiphaluka esifutshane.Kule meko, i-insulation kunye nokucoca kufuneka kwenziwe, kwaye amanyathelo ahambelanayo okutywinwa kufuneka athathwe.
(2) Xa iqhosha lisetyenziswa kwindawo yobushushu obuphezulu, kulula ukukhubaza kunye nobudala beplastiki, okubangela ukuba iqhosha likhulule, libangele isiphaluka esifutshane phakathi kwezikrufu ze-terminal.Ngokwemeko, indandatho yokuqinisa ingadityaniswa ukuze iqiniswe ukuze isetyenziswe ngexesha lofakelo, okanye i-tube yeplastiki ye-insulating ingafakwa kwi-screw ye-wiring ukukhusela ukukhulula.
3Ngoko ke, akufanelekanga ukusetyenziswa kwiindawo apho amandla ahlala ixesha elide;ukuba ufuna ukuyisebenzisa, ungathoba ngokufanelekileyo amandla ombane ebhalbhu ukwandisa ubomi bayo.
(4) Ukuba uqhagamshelwano olubi lufunyenwe, isizathu kufuneka siphandwe: ukuba indawo yokudibanisa yonakaliswe, inokulungiswa ngefayile ecocekileyo;ukuba kukho ukungcola okanye i-soot kwindawo yokudibanisa, kufuneka ihlanjululwe ngendwangu ecocekileyo yekotoni efakwe kwi-solvent;ukuba yintlambo yoqhagamshelwano Ukuba ayiphumelelanga, kufuneka itshintshwe;ukuba umnxibelelwano utshiswe kakhulu, umkhiqizo kufuneka utshintshwe.
GNY51-1-01
(Tshintsha tkwezobugcisaIimpawu):
| (INTO） | (Technical parameter) | (Ixabiso） | |
| 1 | (Umlinganiselo woMbane) | 10A 250VAC | |
| 2 | (Ukuchasa uQhagamshelwano) | ≤50mΩ( Ixabiso lokuqala) | |
| 3 | (Ukumelana ne-Insulation) | ≥100MΩ(500VDC) | |
| 4 | (i-Dielectric Voltage) | (phakathi kweetheminali ezingadityaniswanga) | 500V/0.5mA/60S |
| (phakathi kweetheminali kunye nesakhelo sentsimbi) | 1500V/0.5mA/60S | ||
| 5 | (Ubomi boMbane) | ≥50000 imijikelo | |
| 6 | (Ubomi boomatshini) | ≥100000 imijikelo | |
| 7 | (Ubushushu bokusebenza) | 0℃125℃ | |
| 8 | (Izandi zokuSebenza) | (Ezombane):15imijikelo(Oomatshini):60imijikelo | |
| 9 | (ubungqina bokungcangcazela) | (Izakhelo zokungcangcazela):10～55HZ; (Amplitude):1.5mm; (Imikhomba-ndlela emithathu):1H | |
| 10 | (Amandla e-Solder): (Ngaphezu kwe-80% yenxalenye entywilisiweyo iya kugqunywa nge-solder) | (Ubushushu bokuSonga):235±5℃(Ixesha lokuntywiliselwa):2～3S | |
| 11 | (Ukumelana nobushushu beSolder) | (I-Dip Soldering):260±5℃ 5±1S(Ukusoda ngesandla):300±5℃ 2～3S | |
| 12 | (iiMvume zoKhuseleko) | UL, CSA, TUV, CQC, CE | |
| 13 | (Iimeko zoVavanyo) | (Ubushushu be-Ambient):20±5℃ (Ukufuma okuzalanayo):65±5%RH(Uxinzelelo loMoya):86～106KPa | |
GNY51-1-02
(Tshintsha tkwezobugcisaIimpawu):
| (INTO） | (Technical parameter) | (Ixabiso） | |
| 1 | (Umlinganiselo woMbane) | 10A 250VAC | |
| 2 | (Ukuchasa uQhagamshelwano) | ≤50mΩ( Ixabiso lokuqala) | |
| 3 | (Ukumelana ne-Insulation) | ≥100MΩ(500VDC) | |
| 4 | (i-Dielectric Voltage) | (phakathi kweetheminali ezingadityaniswanga) | 500V/0.5mA/60S |
| (phakathi kweetheminali kunye nesakhelo sentsimbi) | 1500V/0.5mA/60S | ||
| 5 | (Ubomi boMbane) | ≥50000 imijikelo | |
| 6 | (Ubomi boomatshini) | ≥100000 imijikelo | |
| 7 | (Ubushushu bokusebenza) | 0℃125℃ | |
| 8 | (Izandi zokuSebenza) | (Ezombane):15imijikelo(Oomatshini):60imijikelo | |
| 9 | (ubungqina bokungcangcazela) | (Izakhelo zokungcangcazela):10～55HZ; (Amplitude):1.5mm; (Imikhomba-ndlela emithathu):1H | |
| 10 | (Amandla e-Solder): (Ngaphezu kwe-80% yenxalenye entywilisiweyo iya kugqunywa nge-solder) | (Ubushushu bokuSonga):235±5℃(Ixesha lokuntywiliselwa):2～3S | |
| 11 | (Ukumelana nobushushu beSolder) | (I-Dip Soldering):260±5℃ 5±1S(Ukusoda ngesandla):300±5℃ 2～3S | |
| 12 | (iiMvume zoKhuseleko) | UL, CSA, TUV, CQC, CE | |
| 13 | (Iimeko zoVavanyo) | (Ubushushu be-Ambient):20±5℃ (Ukufuma okuzalanayo):65±5%RH(Uxinzelelo loMoya):86～106KPa | |
GNY51-2-200
Tshintsha iimpawu zobugcisa
GNY51
(Tshintsha tkwezobugcisaIimpawu):
| (INTO） | (Technical parameter) | (Ixabiso） | |
| 1 | (Umlinganiselo woMbane) | 10A 250VAC | |
| 2 | (Ukuchasa uQhagamshelwano) | ≤50mΩ( Ixabiso lokuqala) | |
| 3 | (Ukumelana ne-Insulation) | ≥100MΩ(500VDC) | |
| 4 | (i-Dielectric Voltage) | (phakathi kweetheminali ezingadityaniswanga) | 500V/0.5mA/60S |
| (phakathi kweetheminali kunye nesakhelo sentsimbi) | 1500V/0.5mA/60S | ||
| 5 | (Ubomi boMbane) | ≥50000 imijikelo | |
| 6 | (Ubomi boomatshini) | ≥100000 imijikelo | |
| 7 | (Ubushushu bokusebenza) | 0℃125℃ | |
| 8 | (Izandi zokuSebenza) | (Ezombane):15imijikelo(Oomatshini):60imijikelo | |
| 9 | (ubungqina bokungcangcazela) | (Izandi zokungcangcazela):10～55HZ; (I-Amplitude): 1.5mm; (Imikhomba-ndlela emithathu): 1H | |
| 10 | (Amandla e-Solder): (Ngaphezu kwe-80% yenxalenye entywilisiweyo iya kugqunywa nge-solder) | (Ubushushu bokuSonga):235±5℃(Ixesha lokuntywiliselwa):2～3S | |
| 11 | (Ukumelana nobushushu beSolder) | (I-Dip Soldering):260±5℃ 5±1S(Ukusoda ngesandla):300±5℃ 2～3S | |
| 12 | (iiMvume zoKhuseleko) | UL, CSA, TUV, CQC, CE | |
| 13 | (Iimeko zoVavanyo) | (Ubushushu be-Ambient):20±5℃ (Ukufuma okuzalanayo):65±5%RH (Uxinzelelo loMoya):86～106KPa | |
