HK-04G AT
Tshintsha izenzo zeempawu
| Iimpawu ezichazayo zokusebenza | IParameter yokuSebenza | Ushunqulelo | Iiyunithi | Ixabiso |
 | Isikhundla sasimahla | FP | mm | 12.1±0.2 |
| Isikhundla sokuSebenza | OP | mm | 11.5±0.5 | |
| Ukukhulula Isikhundla | RP | mm | 11.7±0.5 | |
| Indawo yohambo iyonke | TTP | mm | 10.7 | |
| Amandla okusebenza | OF | N | 1.0~3.5 | |
| Ukukhulula amandla | RF | N | - | |
| Amandla ohambo olupheleleyo | TTF | N | - | |
| Ukuhamba kwangaphambili | PT | mm | 0.3~1.0 | |
| Ukuhamba ngaphezulu | OT | mm | 0.2Miz | |
| Ukushukuma Umahluko | MD | mm | 0.4 Ubuninzi |
Tshintsha iiMpawu zezobugcisa
| INTO | ipharamitha yobugcisa | Ixabiso | |
| 1 | Ukulinganisa koMbane | 5A/10A 250VAC | |
| 2 | Qhagamshelana Ukuchasa | ≤50mΩIxabiso lokuqala | |
| 3 | I-Insulation Resistance | ≥100MΩ500VDC | |
| 4 | Umbane weDielectric | phakathi kweetheminali ezingadityaniswanga | 500V/0.5mA/60S |
| phakathi kweetheminali kunye nesakhelo sesinyithi | 1500V/0.5mA/60S | ||
| 5 | Ubomi boMbane | ≥10000 imijikelo | |
| 6 | Ubomi boomatshini | ≥100000 imijikelo | |
| 7 | Ubushushu bokusebenza | 0 ~ 125℃ | |
| 8 | Ukuphindaphinda okuSebenzayo | zombane:15imijikeloOomatshini:60imijikelo | |
| 9 | Ubungqina bokungcangcazela | Ukungcangcazela Frequency:10~55HZ; Ubungakanani: 1.5mm; Iindlela ezintathu:1H | |
| 10 | Amandla eSolder: Ngaphezu kwe-80% yenxalenye entywilisiweyo iya kugqunywa ngesolder | Ubushushu beSoldering:235±5℃Ixesha lokuntywiliselwa:2~3S | |
| 11 | I-Solder Heat Resistance | Dip Soldering:260±5℃ 5±1SManual Soldering:300±5℃ 2~3S | |
| 12 | Izamkelo zoKhuseleko | UL,CSA,VDE,ENEC,CE | |
| 13 | Iimeko zovavanyo | Ubushushu be-Ambient:20±5℃ Isihlobo Ukufuma: 65±5%RH Uxinzelelo loMoya: 86 ~ 106KPa | |
Isicelo sokutshintsha: sisetyenziswa kakhulu kwizixhobo zasekhaya ezahlukeneyo, izixhobo zombane, izixhobo ezizisebenzelayo, izixhobo zonxibelelwano, izixhobo zombane zeemoto, izixhobo zombane kunye namanye amacandelo.
11
Bhala umyalezo wakho apha kwaye uwuthumele kuthi
