I-HK-04G-LT
Tshintsha izenzo zeempawu
Iimpawu ezichazayo zokusebenza | IParameter yokuSebenza | Ushunqulelo | Iiyunithi | Ixabiso |
Isikhundla sasimahla | FP | mm | 12.1±0.2 | |
Isikhundla sokuSebenza | OP | mm | 11.5±0.5 | |
Ukukhulula Isikhundla | RP | mm | 11.7±0.5 | |
Indawo yohambo iyonke | TTP | mm | 10.5±0.3 | |
Amandla okusebenza | OF | N | 1.0~3.5 | |
Ukukhulula amandla | RF | N | - | |
Amandla ohambo olupheleleyo | TTF | N | - | |
Ukuhamba kwangaphambili | PT | mm | 0.3~1.0 | |
Ukuhamba ngaphezulu | OT | mm | 0.2Miz | |
Ukushukuma Umahluko | MD | mm | 0.4 Ubuninzi |
Tshintsha iiMpawu zezobugcisa
INTO | ipharamitha yobugcisa | Ixabiso | |
1 | Ukulinganisa koMbane | 52A 250VAC | |
2 | Qhagamshelana Ukuchasa | ≤50mΩIxabiso lokuqala | |
3 | I-Insulation Resistance | ≥100MΩ500VDC | |
4 | Umbane weDielectric | phakathi kweetheminali ezingadityaniswanga | 500V/0.5mA/60S |
phakathi kweetheminali kunye nesakhelo sesinyithi | 1500V/0.5mA/60S | ||
5 | Ubomi boMbane | ≥10000 imijikelo | |
6 | Ubomi boomatshini | ≥100000 imijikelo | |
7 | Ubushushu bokusebenza | -25 ~ 125℃ | |
8 | Ukuphindaphinda okuSebenzayo | zombane:15imijikelo Oomatshini:60imijikelo | |
9 | Ubungqina bokungcangcazela | UkuVibration Frequency:10 ~ 55HZ; Ubungakanani: 1.5mm; Iindlela ezintathu:1H | |
10 | Amandla eSolder: Ngaphezu kwe-80% yenxalenye entywilisiweyo iya kugqunywa ngesolder | Soldering Ubushushu:235±5℃ Ixesha lokuntywiliselwa:2~3S | |
11 | I-Solder Heat Resistance | Dip Soldering:260±5℃ 5±1S Ukusoda ngokuManuwali:300±5℃ 2~3S | |
12 | Izamkelo zoKhuseleko | UL,CSA,VDE,ENEC,CE | |
13 | Iimeko zovavanyo | Ubushushu be-Ambient:20±5℃ Ukufuma okuzalanayo: 65±5%RH Uxinzelelo loMoya: 86 ~ 106KPa |
Isicelo sokutshintsha: sisetyenziswa kakhulu kwizixhobo zasekhaya ezahlukeneyo, izixhobo zombane, izixhobo ezizisebenzelayo, izixhobo zonxibelelwano, izixhobo zombane zeemoto, izixhobo zombane kunye namanye amacandelo.
11
Bhala umyalezo wakho apha kwaye uwuthumele kuthi