HK-14-16AP-605
| Iimpawu ezichazayo zokusebenza | IParameter yokuSebenza | Ixabiso | Iiyunithi |
 | Isikhundla sasimahla seFP | 15.9±0.2 | mm |
| Isikhundla sokuSebenza i-OP | 14.9±0.5 | mm | |
| Ukukhulula Isikhundla RP | 15.2±0.5 | mm | |
| Indawo yohambo iyonke | 13.1 | mm | |
| Amandla okusebenza OF | 0.25~4 | N | |
| Ukukhulula amandla RF | - | N | |
| Unyanzeliso lokuhamba lulonke lwe-TTF | - | N | |
| Ngaphambi kokuHamba i-PT | 0.5~1.6 | mm | |
| Ngaphezulu kokuHamba OT | 1.0Miz | mm | |
| Movement Differential MD | 0.4 Ubuninzi | mm |
Tshintsha iimpawu zobugcisa
| INTO | ipharamitha yobugcisa | Ixabiso | |
| 1 | Qhagamshelana Ukuchasa | ≤30mΩ Ixabiso lokuqala | |
| 2 | I-Insulation Resistance | ≥100MΩ500VDC | |
| 3 | Umbane weDielectric | phakathi kweetheminali ezingadityaniswanga | 1000V/0.5mA/60S |
| phakathi kweetheminali kunye nesakhelo sesinyithi | 3000V/0.5mA/60S | ||
| 4 | Ubomi boMbane | ≥50000 imijikelo | |
| 5 | Ubomi boomatshini | ≥1000000 imijikelo | |
| 6 | Ubushushu bokusebenza | -25 ~ 125℃ | |
| 7 | Ukuphindaphinda okuSebenzayo | zombane:15 imijikelo Mechanical:60 imijikelo | |
| 8 | Ubungqina bokungcangcazela | UkuVibration Frequency:10 ~ 55HZ; Ubungakanani: 1.5mm; Iindlela ezintathu:1H | |
| 9 | Amandla eSolder: Ngaphezu kwe-80% yenxalenye entywilisiweyo iya kugqunywa ngesolder | Soldering Ubushushu:235±5℃ Ixesha lokuntywiliselwa:2~3S | |
| 10 | I-Solder Heat Resistance | Dip Soldering:260±5℃ 5±1S Ukusoda ngokuManuwali:300±5℃ 2~3S | |
| 11 | Izamkelo zoKhuseleko | UL,CSA,VDE,ENEC,TUV,CE,KC,CQC | |
| 12 | Iimeko zovavanyo | Ubushushu be-Ambient:20±5℃ Ukufuma okuzalanayo: 65±5%RH Uxinzelelo loMoya: 86 ~ 106KPa | |
Isicelo sokutshintsha: sisetyenziswa kakhulu kwizixhobo zasekhaya ezahlukeneyo, izixhobo zombane, izixhobo ezizisebenzelayo, izixhobo zonxibelelwano, izixhobo zombane zeemoto, izixhobo zombane kunye namanye amacandelo.
Bhala umyalezo wakho apha kwaye uwuthumele kuthi
