DK4-BZ-007
| (Awọn ẹya asọye ti iṣẹ) | (Parameter Iṣẹ) | (Ikukuru) | (Awọn ẹya) |
|
| (Ipo Ọfẹ) | FP | mm |
| (Ipo Iṣiṣẹ) | OP | mm | |
| (Ipo itusilẹ) | RP | mm | |
| (Apapọ Ipo irin ajo) | TTP | mm | |
| (Agbofinro Iṣẹ) | OF | N | |
| (Agbofinro Tu silẹ) | RF | N | |
| (Apapọ agbara irin ajo) | TTF | N | |
| (Irin-ajo Ṣaaju) | PT | mm | |
| (Lori Irin-ajo) | OT | mm | |
| (Iyatọ Iṣipopada) | MD | mm |
Yipada imọ Abuda
| (Nkan) | (paramita imọ-ẹrọ) | (Iye) | |
| 1 | (Iwọn Itanna) | 10 (1.5) A 250VAC | |
| 2 | (Olubasọrọ Resistance) | ≤50mΩ(Iye akọkọ) | |
| 3 | (Atako idabobo) | ≥100MΩ(500VDC) | |
| 4 | (Dielectric Foliteji) | (laarin awọn ebute ti ko ni asopọ) | 500V / 0.5mA / 60S |
| (laarin awọn ebute ati fireemu irin) | 1500V/0.5mA/60S | ||
| 5 | (Igbesi aye Itanna) | ≥10000 iyipo | |
| 6 | (Igbesi aye ẹrọ) | ≥3000000 iyipo | |
| 7 | (Iwọn otutu ti nṣiṣẹ) | -25 ~ 105 ℃ | |
| 8 | (Igbohunsafẹfẹ Ṣiṣẹ) | (itanna): 15awọn iyipo(Mekaniki):60awọn iyipo | |
| 9 | (Imudaniloju gbigbọn) | (Igbohunsafẹfẹ Gbigbọn): 10 ~ 55HZ; (Titobi): 1.5mm; (Awọn itọnisọna mẹta): 1H | |
| 10 | (Agbara Solder): (Die sii ju 80% ti apakan immersed yoo wa ni bo pelu solder) | (Iwọn otutu tita): 235 ± 5 ℃ (Aago Immersing) ：2～3S | |
| 11 | (Solder Heat Resistance) | (Dip Soldering): 260 ± 5 ℃ 5 ± 1S (Afọwọṣe Soldering) | |
| 12 | (Awọn ifọwọsi Aabo) | UL, CSA, TUV, ENEC | |
| 13 | (Awọn ipo idanwo) | (Iwọn otutu ibaramu): 20 ± 5 ℃ (Ọriniinitutu ibatan) : 65 ± 5% RH (Atẹgun afẹfẹ): 86 ~ 106KPa | |
11
Kọ ifiranṣẹ rẹ nibi ki o si fi si wa
