HK-04G AD
Yipada igbese Abuda
| Awọn ẹya ara ẹrọ asọye ti isẹ | Parameter iṣẹ | Kukuru | Awọn ẹya | Iye |
 | Ipo ọfẹ | FP | mm | 12.1 ± 0.2 |
| Ipo Iṣiṣẹ | OP | mm | 11.5 ± 0.5 | |
| Ipo idasilẹ | RP | mm | 11.7 ± 0.5 | |
| Lapapọ ipo irin ajo | TTP | mm | 10.7 | |
| Agbara Iṣiṣẹ | OF | N | 1.0 ~ 3.5 | |
| Tu silẹ Force | RF | N | - | |
| Total ajo Force | TTF | N | - | |
| Ṣaaju Irin-ajo | PT | mm | 0.3 ~ 1.0 | |
| Lori Irin-ajo | OT | mm | 0.2 min | |
| Iyatọ gbigbe | MD | mm | 0.4 ti o pọju |
Yipada imọ Abuda
| Nkan | imọ paramita | Iye | |
| 1 | Itanna Rating | 5A/10A 250VAC | |
| 2 | Olubasọrọ Resistance | ≤50mΩIye akọkọ | |
| 3 | Idabobo Resistance | ≥100MΩ500VDC | |
| 4 | Dielectric Foliteji | laarin ti kii-ti sopọ ebute | 500V / 0.5mA / 60S |
| laarin awọn ebute oko ati irin fireemu | 1500V/0.5mA/60S | ||
| 5 | Itanna Life | ≥10000 iyipo | |
| 6 | Mechanical Life | ≥100000 iyipo | |
| 7 | Awọn iwọn otutu ti nṣiṣẹ | 0 ~ 125℃ | |
| 8 | Igbohunsafẹfẹ Ṣiṣẹ | itanna:15awọn iyipoMechanical:60awọn iyipo | |
| 9 | Ẹri gbigbọn | Igbohunsafẹfẹ Igbohunsafẹfẹ: 10 ~ 55HZ; Iwọn titobi: 1.5mm; Awọn itọnisọna mẹta: 1H | |
| 10 | Agbara Solder: Diẹ sii ju 80% ti apakan immersed yoo wa ni bo pelu solder | Awọn iwọn otutu tita:235±5℃Immersing Time:2~3S | |
| 11 | Solder Heat Resistance | Soldering Dip: 260± 5℃ 5 ± 1Sọmu onisọpọ: 300± 5℃ 2 ~ 3S | |
| 12 | Awọn Ifọwọsi Aabo | UL, CSA, VDE, ENEC, CE | |
| 13 | Awọn ipo Idanwo | Ibaramu otutu:20±5℃ ibatan Ọriniinitutu: 65± 5% RH Agbara afẹfẹ: 86 ~ 106KPa | |
Ohun elo Yipada: lilo pupọ ni ọpọlọpọ awọn ohun elo ile, ohun elo itanna, ohun elo adaṣe, ohun elo ibaraẹnisọrọ, ẹrọ itanna, awọn irinṣẹ agbara ati awọn aaye miiran.
11
Kọ ifiranṣẹ rẹ nibi ki o si fi si wa
