HK-14-16AP-600
| Awọn ẹya ara ẹrọ asọye ti isẹ | Parameter iṣẹ | Iye | Awọn ẹya |
 | Free Ipo FP | 15.9 ± 0.2 | mm |
| Ipo iṣẹ OP | 14.9 ± 0.5 | mm | |
| Idasile Ipo RP | 15.2 ± 0.5 | mm | |
| Lapapọ ipo irin ajo | 13.1 | mm | |
| Awọn ọna Force OF | 0.25-4 | N | |
| Tu silẹ Force RF | - | N | |
| Total ajo Force TTF | - | N | |
| Ṣaaju Irin-ajo PT | 0.5 ~ 1.6 | mm | |
| Lori Irin-ajo OT | 1.0 min | mm | |
| Iyatọ gbigbe MD | 0.4 ti o pọju | mm |
Yipada imọ Abuda
| Nkan | imọ paramita | Iye | |
| 1 | Olubasọrọ Resistance | ≤30mΩ Ipilẹṣẹ iye | |
| 2 | Idabobo Resistance | ≥100MΩ500VDC | |
| 3 | Dielectric Foliteji | laarin ti kii-ti sopọ ebute | 1000V/0.5mA/60S |
| laarin awọn ebute oko ati irin fireemu | 3000V / 0.5mA / 60S | ||
| 4 | Itanna Life | ≥50000 iyipo | |
| 5 | Mechanical Life | ≥1000000 awọn iyipo | |
| 6 | Awọn iwọn otutu ti nṣiṣẹ | -25 ~ 125 ℃ | |
| 7 | Igbohunsafẹfẹ Ṣiṣẹ | itanna: 15 waye Mechanical: 60 iyipo | |
| 8 | Ẹri gbigbọn | Igbohunsafẹfẹ Igbohunsafẹfẹ: 10 ~ 55HZ; Iwọn titobi: 1.5mm; Awọn itọnisọna mẹta: 1H | |
| 9 | Agbara Solder: Diẹ sii ju 80% ti apakan immersed yoo wa ni bo pelu solder | Awọn iwọn otutu tita: 235 ± 5 ℃ Akoko Ibọsi: 2 ~ 3S | |
| 10 | Solder Heat Resistance | Dip Soldering:260±5℃ 5±1S Soldering Afowoyi: 300± 5℃ 2 ~ 3S | |
| 11 | Awọn Ifọwọsi Aabo | UL, CSA,VDE,ENEC,TUV,CE,KC,CQC | |
| 12 | Awọn ipo Idanwo | Iwọn otutu ibaramu: 20± 5℃ Ọriniinitutu ibatan: 65± 5% RH Agbara afẹfẹ: 86 ~ 106KPa | |
Ohun elo Yipada: lilo pupọ ni ọpọlọpọ awọn ohun elo ile, ohun elo itanna, ohun elo adaṣe, ohun elo ibaraẹnisọrọ, ẹrọ itanna, awọn irinṣẹ agbara ati awọn aaye miiran.
Kọ ifiranṣẹ rẹ nibi ki o si fi si wa
