I-DK4-BZ-019
| (Izici ezichazayo zokusebenza) | (Ipharamitha esebenzayo) | (Isifinyezo) | (Amayunithi) |
|
| (Isikhundla samahhala) | FP | mm |
| (Isikhundla sokuSebenza) | OP | mm | |
| (Isikhundla Sokukhipha) | RP | mm | |
| (Inani lendawo yokuhamba) | I-TTP | mm | |
| (Amandla Okusebenza) | OF | N | |
| (Amandla Okukhipha) | RF | N | |
| (Ingqikithi Yamandla Okuvakasha) | I-TTF | N | |
| (Ngaphambi Kokuhamba) | PT | mm | |
| (Ngaphezu Kohambo) | OT | mm | |
| (Umehluko Wokunyakaza) | MD | mm |
Shintsha Izimpawu zobuchwepheshe
| (INTO） | (ipharamitha yezobuchwepheshe) | (Inani） | |
| 1 | (Isilinganiso sikagesi) | 10(1.5)A 250VAC | |
| 2 | (Ukumelana Nokuxhumana) | ≤50mΩ( Inani lokuqala) | |
| 3 | (I-Insulation Resistance) | ≥100MΩ(500VDC) | |
| 4 | (I-Dielectric Voltage) | (phakathi kwamatheminali angaxhumekile) | 500V/0.5mA/60S |
| (phakathi kwamatheminali nohlaka lwensimbi) | 1500V/0.5mA/60S | ||
| 5 | (Impilo kagesi) | ≥10000 imijikelezo | |
| 6 | (Impilo Yemishini) | ≥3000000 imijikelezo | |
| 7 | (Izinga lokushisa elisebenzayo) | -25℃105℃ | |
| 8 | (Imvamisa yokusebenza) | (Ekagesi):15imijikelezo(Omakhenikha):60imijikelezo | |
| 9 | (Ubufakazi bokudlidliza) | (Imvamisa yokudlidliza):10-55HZ; (Amplitude):1.5mm; (Izikhombisi-ndlela ezintathu): 1H | |
| 10 | (Ikhono le-Solder): (Ingxenye engaphezu kuka-80% yengxenye ecwilisiwe izombozwa nge-solder) | (Ithempelesha Yokuhlanganisa):235±5℃(Isikhathi Sokucwiliswa):2～3S | |
| 11 | (I-Solder Heat Resistance) | (I-Dip Soldering):260±5℃ 5±1S(Ukusoda Ngesandla):300±5℃ 2～3S | |
| 12 | (Izimvume Zokuphepha) | I-UL, CSA, TUV,ENEC | |
| 13 | (Izimo Zokuhlola) | (Ithempelesha ye-Ambient):20±5℃ (Umswakama Ohlobene):65±5%RH (Ingcindezi Yomoya):86–106KPa | |
Bhala umlayezo wakho lapha futhi usithumelele wona
