FSK-18-D-007
Shintsha Izimpawu zobuchwepheshe
INTO) | (ipharamitha yezobuchwepheshe) | (Inani) | |
1 | (Isilinganiso sikagesi) | 0.1A 250VAC | |
2 | (Amandla Okusebenza) | 1.0-2.5N | |
3 | (Ukumelana Nokuxhumana) | ≤300mΩ | |
4 | (I-Insulation Resistance) | ≥100MΩ(500VDC) | |
5 | (I-Dielectric Voltage) | (phakathi kwamatheminali angaxhumekile) | 500V/0.5mA/60S |
|
| (phakathi kwamatheminali nohlaka lwensimbi) | 1500V/0.5mA/60S |
6 | (Impilo kagesi) | ≥50000 imijikelezo | |
7 | (Impilo Yemishini) | ≥100000 imijikelezo | |
8 | (Izinga lokushisa elisebenzayo) | -25℃105℃ | |
9 | (Imvamisa yokusebenza) | (Ekagesi):15imijikelezo(Omakhenikha):60imijikelezo | |
10 | (Ubufakazi bokudlidliza) | (Imvamisa yokudlidliza): 10 ~ 55HZ; (Amplitude): 1.5mm; (Izikhombisi-ndlela ezintathu): 1H | |
11 | (Ikhono le-Solder)(Ingxenye engaphezu kuka-80% yengxenye ecwilisiwe izombozwa nge-solder) | (Ithempelesha Yokuhlanganisa):235±5℃(Isikhathi Sokucwiliswa):2~3S | |
12 | (I-Solder Heat Resistance) | (I-Dip Soldering):260±5℃ 5±1SManual Soldering):300±5℃ 2~3S | |
13 | (Izimo Zokuhlola) | (Ithempelesha Yendawo):20±5℃ (Umswakama Ohlobene):65±5%RH(Umfutho Womoya):86~106KPa |