I-GNY51-1-05
Khawulela Ukushintsha I-Stroke PUSH Ikholomu Ye-slug Amaswishi amancane Aluhlaza 1NO 1NC kangcono kune-LXW20-11
I-GNY51-1-05
(Shintsha i-tkwezobuchwephesheIzimpawu):
| (INTO） | (ipharamitha yezobuchwepheshe) | (Inani） | |
| 1 | (Isilinganiso sikagesi) | 10A 250VAC | |
| 2 | (Ukumelana Nokuxhumana) | ≤50mΩ( Inani lokuqala) | |
| 3 | (I-Insulation Resistance) | ≥100MΩ(500VDC) | |
| 4 | (I-Dielectric Voltage) | (phakathi kwamatheminali angaxhumekile) | 500V/0.5mA/60S |
| (phakathi kwamatheminali nohlaka lwensimbi) | 1500V/0.5mA/60S | ||
| 5 | (Impilo kagesi) | ≥50000 imijikelezo | |
| 6 | (Impilo Yemishini) | ≥100000 imijikelezo | |
| 7 | (Izinga lokushisa elisebenzayo) | 0～125℃ | |
| 8 | (Imvamisa yokusebenza) | (Ekagesi):15imijikelezo(Omakhenikha):60imijikelezo | |
| 9 | (Ubufakazi bokudlidliza) | (Imvamisa yokudlidliza): 10 ~ 55HZ; (Amplitude): 1.5mm; (Izikhombisi-ndlela ezintathu): 1H | |
| 10 | (Ikhono le-Solder): (Ingxenye engaphezu kuka-80% yengxenye ecwilisiwe izombozwa nge-solder) | (Ithempelesha Yokuhlanganisa):235±5℃(Isikhathi Sokucwiliswa):2～3S | |
| 11 | (I-Solder Heat Resistance) | (I-Dip Soldering):260±5℃ 5±1S(Ukusoda Ngesandla):300±5℃ 2～3S | |
| 12 | (Izimvume Zokuphepha) | UL,CSA,TUV,CQC,CE | |
| 13 | (Izimo Zokuhlola) | (Ithempelesha Yendawo):20±5℃ (Umswakama Ohlobene):65±5%RH(Umfutho Womoya):86～106KPa | |
Ukusetshenziswa nokugcinwa
(1) Hlola inkinobho njalo ukususa ukungcola kuyo.Ngenxa yebanga elincane phakathi koxhumana nabo benkinobho, ngemva kweminyaka eminingi yokusetshenziswa noma uphawu alulungile, ukungena kothuli noma izigaba ezihlukahlukene ze-emulsion yamafutha enjini kuzobangela ukuthi ukufakwa kuncishiswe noma ngisho nengozi yesifunda esifushane.Kulokhu, ukufakwa kwe-insulation nokuhlanza kufanele kwenziwe, futhi izinyathelo ezihambisanayo zokuvala kufanele zithathwe.
(2) Uma inkinobho isetshenziswa endaweni enezinga eliphezulu lokushisa, kulula ukukhubaza nokuguga ipulasitiki, okubangela ukuba inkinobho ixege, kubangele ukujikeleza okufushane phakathi kwezikulufu zokugcina.Ngokwesimo, indandatho yokubopha ingafakwa ukuze iqinise ukuze isetshenziswe ngesikhathi sokufakwa, noma ishubhu lepulasitiki elivikelayo lingengezwa kusikulufu sezintambo ukuvimbela ukuxega.
(3) Enkinobho enokukhanya kwenkomba, isibani sizofudumala, futhi umthunzi wezibani wepulasitiki uzokhubazekile isikhathi eside, okuzokwenza kube nzima ukufaka isibani esikhundleni.Ngakho-ke, akufanelekile ukusetshenziswa ezindaweni lapho amandla ehlala khona isikhathi eside;uma ufuna ukuyisebenzisa, ungakwazi ukwehlisa ngokufanelekile i-voltage yesibani ukuze welule impilo yayo.
(4) Uma kutholakala ukuthintana okungalungile, isizathu kufanele siphenywe: uma indawo yokuxhumana yonakalisiwe, ingalungiswa ngefayela elihle;uma kukhona ukungcola noma umsizi endaweni yokuxhumana, kufanele kusulwe ngendwangu ehlanzekile kakotini efakwe ku-solvent;uma kuyintwasahlobo yokuxhumana Uma ihluleka, kufanele ishintshwe;uma othintana naye eshiswe kakhulu, umkhiqizo kufanele ushintshwe.
I-GNY51-1-01
(Shintsha i-tkwezobuchwephesheIzimpawu):
| (INTO） | (ipharamitha yezobuchwepheshe) | (Inani） | |
| 1 | (Isilinganiso sikagesi) | 10A 250VAC | |
| 2 | (Ukumelana Nokuxhumana) | ≤50mΩ( Inani lokuqala) | |
| 3 | (I-Insulation Resistance) | ≥100MΩ(500VDC) | |
| 4 | (I-Dielectric Voltage) | (phakathi kwamatheminali angaxhumekile) | 500V/0.5mA/60S |
| (phakathi kwamatheminali nohlaka lwensimbi) | 1500V/0.5mA/60S | ||
| 5 | (Impilo kagesi) | ≥50000 imijikelezo | |
| 6 | (Impilo Yemishini) | ≥100000 imijikelezo | |
| 7 | (Izinga lokushisa elisebenzayo) | 0～125℃ | |
| 8 | (Imvamisa yokusebenza) | (Ekagesi):15imijikelezo(Omakhenikha):60imijikelezo | |
| 9 | (Ubufakazi bokudlidliza) | (Imvamisa yokudlidliza): 10 ~ 55HZ; (Amplitude): 1.5mm; (Izikhombisi-ndlela ezintathu): 1H | |
| 10 | (Ikhono le-Solder): (Ingxenye engaphezu kuka-80% yengxenye ecwilisiwe izombozwa nge-solder) | (Ithempelesha Yokuhlanganisa):235±5℃(Isikhathi Sokucwiliswa):2～3S | |
| 11 | (I-Solder Heat Resistance) | (I-Dip Soldering):260±5℃ 5±1S(Ukusoda Ngesandla):300±5℃ 2～3S | |
| 12 | (Izimvume Zokuphepha) | UL,CSA,TUV,CQC,CE | |
| 13 | (Izimo Zokuhlola) | (Ithempelesha Yendawo):20±5℃ (Umswakama Ohlobene):65±5%RH(Umfutho Womoya):86～106KPa | |
I-GNY51-1-02
(Shintsha i-tkwezobuchwephesheIzimpawu):
| (INTO） | (ipharamitha yezobuchwepheshe) | (Inani） | |
| 1 | (Isilinganiso sikagesi) | 10A 250VAC | |
| 2 | (Ukumelana Nokuxhumana) | ≤50mΩ( Inani lokuqala) | |
| 3 | (I-Insulation Resistance) | ≥100MΩ(500VDC) | |
| 4 | (I-Dielectric Voltage) | (phakathi kwamatheminali angaxhumekile) | 500V/0.5mA/60S |
| (phakathi kwamatheminali nohlaka lwensimbi) | 1500V/0.5mA/60S | ||
| 5 | (Impilo kagesi) | ≥50000 imijikelezo | |
| 6 | (Impilo Yemishini) | ≥100000 imijikelezo | |
| 7 | (Izinga lokushisa elisebenzayo) | 0～125℃ | |
| 8 | (Imvamisa yokusebenza) | (Ekagesi):15imijikelezo(Omakhenikha):60imijikelezo | |
| 9 | (Ubufakazi bokudlidliza) | (Imvamisa yokudlidliza): 10 ~ 55HZ; (Amplitude): 1.5mm; (Izikhombisi-ndlela ezintathu): 1H | |
| 10 | (Ikhono le-Solder): (Ingxenye engaphezu kuka-80% yengxenye ecwilisiwe izombozwa nge-solder) | (Ithempelesha Yokuhlanganisa):235±5℃(Isikhathi Sokucwiliswa):2～3S | |
| 11 | (I-Solder Heat Resistance) | (I-Dip Soldering):260±5℃ 5±1S(Ukusoda Ngesandla):300±5℃ 2～3S | |
| 12 | (Izimvume Zokuphepha) | UL,CSA,TUV,CQC,CE | |
| 13 | (Izimo Zokuhlola) | (Ithempelesha Yendawo):20±5℃ (Umswakama Ohlobene):65±5%RH(Umfutho Womoya):86～106KPa | |
I-GNY51-2-200
Shintsha Izimpawu zobuchwepheshe
GNY51
(Shintsha i-tkwezobuchwephesheIzimpawu):
| (INTO） | (ipharamitha yezobuchwepheshe) | (Inani） | |
| 1 | (Isilinganiso sikagesi) | 10A 250VAC | |
| 2 | (Ukumelana Nokuxhumana) | ≤50mΩ( Inani lokuqala) | |
| 3 | (I-Insulation Resistance) | ≥100MΩ(500VDC) | |
| 4 | (I-Dielectric Voltage) | (phakathi kwamatheminali angaxhumekile) | 500V/0.5mA/60S |
| (phakathi kwamatheminali nohlaka lwensimbi) | 1500V/0.5mA/60S | ||
| 5 | (Impilo kagesi) | ≥50000 imijikelezo | |
| 6 | (Impilo Yemishini) | ≥100000 imijikelezo | |
| 7 | (Izinga lokushisa elisebenzayo) | 0～125℃ | |
| 8 | (Imvamisa yokusebenza) | (Ekagesi):15imijikelezo(Omakhenikha):60imijikelezo | |
| 9 | (Ubufakazi bokudlidliza) | (Imvamisa yokudlidliza):10-55HZ; (Amplitude):1.5mm; (Izikhombisi-ndlela ezintathu): 1H | |
| 10 | (Ikhono le-Solder):(Ingxenye engaphezu kuka-80% yengxenye ecwilisiwe izombozwa nge-solder) | (Ithempelesha Yokuhlanganisa):235±5℃(Isikhathi Sokucwiliswa):2～3S | |
| 11 | (I-Solder Heat Resistance) | (I-Dip Soldering):260±5℃ 5±1S(Ukusoda Ngesandla):300±5℃ 2～3S | |
| 12 | (Izimvume Zokuphepha) | UL,CSA,TUV,CQC,CE | |
| 13 | (Izimo Zokuhlola) | (Ithempelesha ye-Ambient):20±5℃ (Umswakama Ohlobene):65±5%RH (Ingcindezi Yomoya):86–106KPa | |
