I-HK-04G-1AZ-018
(Izici ezichazayo zokusebenza) | (Ipharamitha esebenzayo) | (Isifinyezo) | (Amayunithi) | (Inani) |
| (Isikhundla samahhala) | FP | mm | 12.1±0.2 |
(Isikhundla sokuSebenza) | OP | mm | 11.5±0.5 | |
(Isikhundla Sokukhipha) | RP | mm | 11.7±0.5 | |
(Inani lendawo yokuhamba) | I-TTP | mm | 10.5±0.3 | |
(Amandla Okusebenza) | OF | N | 1.0-3.5 | |
(Amandla Okukhipha) | RF | N | - | |
(Ingqikithi Yamandla Okuvakasha) | I-TTF | N | - | |
(Ngaphambi Kokuhamba) | PT | mm | 0.3-1.0 | |
(Ngaphezu Kohambo) | OT | mm | 0.2(Amaminithi) | |
(Umehluko Wokunyakaza) | MD | mm | 0.4(Ubukhulu) |
Shintsha Izimpawu zobuchwepheshe
(INTO) | (ipharamitha yezobuchwepheshe) | (Inani) | |
1 | (Isilinganiso sikagesi) | 5(2)A 250VAC | |
2 | (Ukumelana Nokuxhumana) | ≤50mΩ( Inani lokuqala) | |
3 | (I-Insulation Resistance) | ≥100MΩ(500VDC) | |
4 | (I-Dielectric Voltage) | (phakathi kwamatheminali angaxhumekile) | 500V/0.5mA/60S |
|
| (phakathi kwamatheminali nohlaka lwensimbi) | 1500V/0.5mA/60S |
5 | (Impilo kagesi) | ≥10000 imijikelezo | |
6 | (Impilo Yemishini) | ≥100000 imijikelezo | |
7 | (Izinga lokushisa elisebenzayo) | -25℃125℃ | |
8 | (Imvamisa yokusebenza) | (Ekagesi):15imijikelezo (Omakhenikha):60imijikelezo | |
9 | (Ubufakazi bokudlidliza) | (Imvamisa yokudlidliza):10-55HZ; (Amplitude):1.5mm; (Izikhombisi-ndlela ezintathu): 1H | |
10 | (Ikhono le-Solder):(Ingxenye engaphezu kuka-80% yengxenye ecwilisiwe izombozwa nge-solder) | (Izinga lokushisa le-Soldering): 235±5℃ (Isikhathi Sokucwiliswa):2~3S | |
11 | (I-Solder Heat Resistance) | (I-Dip Soldering):260±5℃ 5±1S (I-Soldering Mathupha):300±5℃ 2~3S | |
12 | (Izimvume Zokuphepha) | UL, CSA, VDE, ENEC, CE | |
13 | (Izimo Zokuhlola) | (Izinga lokushisa le-Ambient):20±5℃ (Ukuswakama Okuhlobene):65±5%RH (Ingcindezi Yomoya):86–106KPa |
Bhala umlayezo wakho lapha futhi usithumelele wona