HK-10-3A-009
Shintsha Izimpawu Zezobuchwepheshe
(INTO) | (ipharamitha yezobuchwepheshe) | (Inani) | |
1 | (Isilinganiso sikagesi) | 3A 250VAC | |
2 | (Ukumelana Nokuxhumana) | ≤50mΩ( Inani lokuqala) | |
3 | (I-Insulation Resistance) | ≥100MΩ(500VDC) | |
4 | (I-Dielectric Voltage) | (phakathi kwamatheminali angaxhumekile) | 500V/5mA/5S |
(phakathi kwamatheminali nohlaka lwensimbi) | 1500V/5mA/5S | ||
5 | (Impilo kagesi) | ≥10000 imijikelezo | |
6 | (Impilo Yemishini) | ≥1000000 imijikelezo | |
7 | (Izinga lokushisa elisebenzayo) | -25℃85℃ | |
8 | (Imvamisa yokusebenza) | (Ezikagesi):15 imijikelezo (Mechanical):60 imijikelezo | |
9 | (Ubufakazi bokudlidliza) | (Imvamisa yokudlidliza):10~55HZ; (Amplitude):1.5mm; (Izikhombisi-ndlela ezintathu): 1H | |
10 | (Ikhono le-Solder): (Ingxenye engaphezu kuka-80% yengxenye ecwilisiwe izombozwa nge-solder) | (Ithempelesha Yokuhlanganisa):235±5℃(Isikhathi Sokucwiliswa):2~3S | |
11 | (I-Solder Heat Resistance) | (I-Dip Soldering):260±5℃ 5±1S(Ukusoda Ngesandla):300±5℃ 2~3S | |
12 | (Izimvume Zokuphepha) | I-UL, CQC, TUV, CE | |
13 | (Izimo Zokuhlola) | (Ithempelesha ye-Ambient):20±5℃(Umswakama Ohlobene):65±5%RH (Ingcindezi Yomoya):86–106KPa |
Bhala umlayezo wakho lapha futhi usithumelele wona