I-HK-14-1X-16AP-809
| Izici ezichazayo zokusebenza | Ipharamitha esebenzayo | Inani | Amayunithi |
 | Isikhundla samahhala se-FP | 15.9±0.2 | mm |
| Operating Position OP | 14.9±0.5 | mm | |
| Ukukhipha Isikhundla RP | 15.2±0.5 | mm | |
| Ingqikithi Yendawo Yokuhamba | 13.1 | mm | |
| Amandla Okusebenza OF | 0.25~4 | N | |
| Ukukhipha i-Force RF | - | N | |
| I-TTF ephelele yokuhamba | - | N | |
| I-Pre Travel PT | 0.5~1.6 | mm | |
| Nge-Travel OT | 1.0Miz | mm | |
| Movement Differential MD | 0.4Ubukhulu | mm |
Shintsha Izimpawu zobuchwepheshe
| INTO | ipharamitha yezobuchwepheshe | Inani | |
| 1 | Xhumana Nokumelana | ≤30mΩ Inani lokuqala | |
| 2 | I-Insulation Resistance | ≥100MΩ500VDC | |
| 3 | I-Dielectric Voltage | phakathi kwamatheminali angaxhumekile | 1000V/0.5mA/60S |
| phakathi kwamatheminali nohlaka lwensimbi | 3000V/0.5mA/60S | ||
| 4 | Ukuphila kukagesi | ≥50000 imijikelezo | |
| 5 | Impilo Yemishini | ≥1000000 imijikelezo | |
| 6 | Izinga Lokushisa Lokusebenza | -25 ~ 125 ℃ | |
| 7 | Imvamisa Yokusebenza | kagesi: imijikelezo engu-15 Mechanical: imijikelezo engama-60 | |
| 8 | Ubufakazi bokudlidliza | Imvamisa yokudlidliza:10~55HZ; Ubukhulu: 1.5mm; Izindlela ezintathu: 1H | |
| 9 | Amandla e-Solder: Ngaphezu kwe-80% yengxenye ecwilisiwe izombozwa nge-solder | I-Soldering Temperature:235±5℃ Isikhathi Sokucwiliswa:2~3S | |
| 10 | I-Solder Heat Resistance | I-Dip Soldering:260±5℃ 5±1S Ukugoqa ngesandla:300±5℃ 2~3S | |
| 11 | Izimvume Zokuphepha | UL,CSA,VDE,ENEC,TUV,CE,KC,CQC | |
| 12 | Izimo Zokuhlola | I-Ambient Temperature:20±5℃ Ukuswakama Okuhlobene:65±5%RH Ingcindezi Yomoya:86~106KPa | |
Isicelo sokushintsha: sisetshenziswa kakhulu ezintweni zasendlini ezahlukahlukene, okokusebenza kwe-elekthronikhi, okokusebenza ezishintshayo, okokusebenza kwezokuxhumana, ugesi wezimoto, amathuluzi kagesi neminye imikhakha.
Bhala umlayezo wakho lapha futhi usithumelele wona
